Flat Coplanar Heat Exchanger for Double-Sided Electronics Cooling
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Solution Overview
Problem
High-power electronic devices in electric-vehicle applications require effective heat removal, especially in high-ambient temperatures, and existing cooling solutions are cost-sensitive and struggle with achieving high packaging density and efficient double-sided cooling.
Innovation Solution
A flat-coplanar heat exchanger design with a series-wise coolant flow path, featuring upper and lower chambers thermally coupled to both sides of electronic components, and a novel side-by-side manifold connection that allows coolant to flow from one side to the other, eliminating the need for a tall spout and complex coolant manifold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional single-sided cooling design is used, then the device complexity is reduced, but the heat removal efficiency from high-power electronics is insufficient
Solution Approach 1:
The cooling system is segmented into an upper chamber for cooling the upper side of electronics and a lower chamber for cooling the lower side, with each chamber having independent coolant flow paths. This segmentation allows simultaneous double-sided cooling while maintaining manageable complexity through modular design
Solution Approach 2:
The upper and lower chambers are merged into a single integrated heat exchanger assembly with a shared base plate that thermally couples both chambers to the electronics. The coolant flow paths are merged through a series-wise arrangement where coolant exits the lower chamber and enters the upper chamber, eliminating the need for separate cooling systems
2Reliability
If a double-sided cooling system with separate chambers is implemented, then heat removal from both sides of electronics is improved, but the packaging height increases
Solution Approach 1:
The upper chamber and lower chamber are nested together with the lower chamber positioned directly beneath the upper chamber, sharing a common base plate. This nesting arrangement allows both cooling chambers to occupy minimal vertical space while maintaining effective double-sided thermal coupling to the electronics
Solution Approach 2:
The cooling system transitions from a vertical stacked arrangement to a more compact integrated structure where the upper and lower chambers are positioned in adjacent horizontal planes with reduced separation. The series-wise coolant flow connects the chambers through lateral passages, reducing overall packaging height
3Volume of stationary object
If traditional coolant manifold connections are used, then the device complexity is reduced, but the packaging density and heat exchange efficiency are compromised
Solution Approach 1:
The manifold connections for both upper and lower chambers are merged into a single integrated fitting structure. The inlet and outlet ports are positioned adjacently on the same face of the heat exchanger, allowing compact manifold routing while maintaining efficient coolant flow distribution to both chambers
Solution Approach 2:
The manifold connection design repositions the inlet and outlet ports from traditional vertical arrangements to adjacent horizontal positions on the same face. This dimensional reconfiguration allows compact packaging while maintaining efficient coolant flow paths to both upper and lower chambers through optimized internal passage routing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively removes heat from both sides of electronic components, achieving efficient cooling while maintaining a low profile and reducing packaging height, thus enhancing reliability and cost-effectiveness in electric-vehicle applications.
Implementation Method 1
An upper-chamber is thermally coupled to the upper-side. The upper-chamber is configured to guide flowing-coolant from an upper-inlet to an upper-outlet to remove heat from the upper-side. A lower-chamber is thermally coupled to the lower-side.
Implementation Method 2
The upper-chamber is configured to guide flowing-coolant from an upper-inlet to an upper-outlet to remove heat from the upper-side. The lower-chamber is configured to guide flowing-coolant from a lower-inlet to a lower-outlet to remove heat from the lower-side.
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A fluid-cooled electronics assembly (10) for high-power electronics includes an arrangement (16) of electronic components that defines an upper-side (18) of the arrangement (16) and a lower-side (20) of the arrangement (16) opposite the upper-side (18). An upper-chamber (24) is thermally coupled to the upper-side (18), and a lower-chamber (30) thermally coupled to the lower-side (20). The upper-chamber (24) and the lower-chamber (30) are further configured to direct flowing-coolant (14) series-wise from the lower-chamber (30) into the upper-chamber (24). The upper-chamber (24) and the lower-chamber (30) are further configured to cooperatively define a manifold-connection (40) operable to couple the assembly (10) to a manifold-outlet (42) and a manifold-inlet (44) of a coolant-manifold (12). The assembly (10) also includes a fitting (46) configured to define an inlet-port (48) of the assembly (10) that directs the flowing-coolant (14) from the manifold-outlet (42) to the lower-inlet (32), and an outlet-port (50) that directs the flowing-coolant (14) from the upper-outlet (28) to the manifold-inlet (44). The inlet-port (48) and the outlet-port (50) are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section (54).