Liquid Cooled Electronics With Metallic Seals
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Solution Overview
Problem
Existing liquid cooled power electronics assemblies face challenges in preventing electrical shorting and contamination from electrically conductive coolants, which can compromise the reliability and efficiency of power dissipation in high-voltage and high-current electronic devices used in applications like electric vehicles.
Innovation Solution
A liquid cooled power electronics assembly is designed with dielectric plates and metallic seals to isolate the electronic device from conductive coolants, using a housing with an inlet, outlet, and cavity to contain coolant, and employing metallic seals to prevent leakage and contact between the coolant and the device, ensuring effective heat transfer while maintaining electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If electrically conductive coolant is used to cool power electronic devices, then heat transfer efficiency is improved, but electrical shorting and contamination occur
Solution Approach 1:
The assembly is divided into distinct sealed compartments: the electronic device is isolated in one chamber while the conductive coolant circulates in a separate chamber. Metallic seals and dielectric plates create physical barriers that segment the system, allowing thermal coupling through the package while maintaining electrical isolation between the electronics and coolant.
Solution Approach 2:
Dielectric plates are introduced as intermediary components between the electronic device and the conductive coolant. These plates transfer heat from the device to the coolant while preventing direct electrical contact, thus mediating the thermal interaction without compromising electrical isolation.
2Reliability
If metallic seals are used to isolate electronic device from coolant, then electrical isolation is improved, but manufacturing complexity increases
Solution Approach 1:
Multiple functions are merged into the metallic seals: they provide electrical isolation, mechanical sealing, and structural support for the dielectric plates. The seal structure is integrated with the housing and device package, reducing the number of separate components and simplifying the overall assembly process despite the advanced functionality required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electrical shorting and contamination, enhancing the reliability and power dissipation efficiency of the electronic devices by minimizing thermal resistance and ensuring robust seals suitable for automotive applications, as demonstrated by a power dissipating rating of 0.11 °C/W, outperforming existing market solutions like the Viper assembly from Delphi Inc. with a rating of 0.15 °C/W.
Implementation Method 1
The first metallic seal is formed between the portion of the first plate perimeter and the corresponding portion of the second plate perimeter. The first metallic seal is effective to isolate the electronic device from the coolant.
Implementation Method 2
The first dielectric plate, the second dielectric plate, and the first metallic seal cooperate to form a device package. The assembly is configured to tolerate the use of electrically conductive coolant to cool power electronic devices.
Data Source
Figure 1~2B
Figure 3~4
Figure 5~7
AI summary
A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.