Power Electronics Cooling System With Dual-Fluid Heat Exchanger
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for heat exchangers that can effectively integrate with power electronic devices to maintain optimal temperatures under varying load conditions, as these devices generate waste heat that degrades operational efficiency and requires efficient thermal management in refrigeration systems.
Innovation Solution
A cooling system comprising a heat sink thermally coupled to a heat exchanger with distinct flow paths for primary and secondary cooling fluids, where the heat exchanger includes an inlet manifold with a microstructure to facilitate boiling and is optionally integrated with a movement mechanism, such as a fan, to manage fluid flow and thermal loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat exchanger is used to cool power electronic devices, then the structure is simple, but the heat transfer efficiency is insufficient and cannot maintain optimal temperatures under varying load conditions
Solution Approach 1:
The heat exchanger is divided into multiple flow paths (first flow path for primary cooling fluid, second flow path for secondary cooling fluid) to handle different thermal loads separately, allowing independent optimization of each path's cooling capacity and improving overall temperature control reliability
Solution Approach 2:
The system incorporates movable components including a movement mechanism operable to move the secondary cooling fluid, and a fan associated with a condenser, enabling dynamic adjustment of cooling capacity to match varying thermal loads on the power electronic devices
2Temperature
If the cooling system is designed to handle high thermal loads, then temperature control improves, but the system complexity and number of components increase
Solution Approach 1:
The heat exchanger merges multiple cooling functions into a single integrated component, with both primary and secondary cooling fluid flow paths contained within one unit that thermally couples to the heat sink, reducing the need for separate cooling systems while maintaining effective temperature control
Solution Approach 2:
The heat exchanger serves multiple functions simultaneously: it cools the heat sink through the primary cooling fluid path, transfers heat from the secondary cooling fluid, and both heat sources contribute to cooling the power electronic devices, making the system adaptable to various thermal load conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat transfer efficiency, maintains optimal temperatures for power electronic devices, and prevents condensation, thereby improving the operational efficiency and reliability of refrigeration systems.
Implementation Method 1
Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger
Implementation Method 2
a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid
Implementation Method 3
a surface of the inlet manifold has a microstructure. The microstructure is optimized to facilitate boiling of the primary cooling fluid within the inlet manifold
Implementation Method 4
facilitate boiling of the primary cooling fluid
Data Source
AI summary
A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.