Spring-Retained Electronic Stack with Inter-Component Cooling Blocks

The patent uses flexible connection elements (springs) instead of rigid connections to attach carrier plates to the housing. These flexible elements allow the structure to accommodate thermal expansion and contraction forces while maintaining structural integrity, preventing damage to components during temperature fluctuations.

The patent changes the mechanical parameter of the connection from rigid (fixed stiffness) to flexible (variable stiffness through spring compression). This parameter change allows the connection to dynamically adapt to thermomechanical forces, absorbing expansion forces during heating and maintaining stability during cooling.

The patent extracts the cooling function from the housing structure itself and places dedicated cooling blocks with cooling fins directly on the carrier plates holding electronic components. This separation allows the cooling system to be optimized independently for specific high-heat components rather than relying on general housing cooling fins.

The patent applies cooling blocks with cooling fins locally at specific positions where electronic components generate the most heat, rather than uniformly distributing cooling fins on the housing. This localized cooling approach concentrates cooling effectiveness where it is most needed, improving overall cooling efficiency under temperature fluctuations.

The patent designs the thermal management system to serve multiple functions: cooling blocks with cooling fins provide cooling during high temperatures, while the same thermal conduction paths and contact surfaces can facilitate heat transfer from the environment to components during low temperatures. The spring-based mechanical connection also provides both cooling contact pressure and potential heating capability.

The patent creates a dynamic thermal management system where the cooling blocks are pressed against carrier plates by spring force, ensuring optimal thermal contact. This dynamic contact pressure allows the system to adapt to varying thermal conditions, maintaining effective thermal coupling whether heat needs to be conducted away from or toward the electronic components.

The patent merges the cooling block with the carrier plate structure, where the cooling block is integrated directly onto the carrier plate that already holds the electronic components. This integration eliminates the need for separate, complex thermal paths and reduces the number of discrete components and assembly steps required.

The patent incorporates thermal conduction paths directly into the carrier plate structure during its manufacturing, rather than adding them as separate assembly steps. The carrier plate is pre-configured with thermally conductive material or structures that provide immediate heat transport capability when components are mounted, simplifying both manufacturing and assembly.

The patent segments the device structure into modular carrier plates that can be independently removed and replaced. Each carrier plate with its mounted components and cooling block can be detached as a unit from the housing using simple spring-based retention, enabling easy repair and replacement without disassembling the entire device with multiple screws.

The patent uses dynamic spring-based retention instead of fixed screw connections to hold carrier plates. The springs provide sufficient holding force for structural integrity during operation but allow for easy manual release and removal of components, combining strength with ease of repair in a single retention mechanism.