Slot-Level Cooling Canisters for Server Rack Airflow Isolation
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Solution Overview
Problem
Current cooling systems in computing facilities face inefficiencies due to the use of numerous small fans and rack-level fans, which lead to surplus cooling in some areas and inadequate cooling in others, along with air leaks, resulting in wasted energy and reduced performance.
Innovation Solution
The implementation of cooling canisters with sealing surfaces and louvers that isolate airflow between subsets of servers, allowing for independent airflow regulation and reduction of air leaks, using shared air moving devices that provide tailored cooling based on the thermal needs of individual server subsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If rack level fans are used to cool computer systems mounted in a rack, then cooling coverage is improved, but air leaks occur through rack air passages resulting in energy waste
Solution Approach 1:
The invention divides the rack cooling system into multiple slot-level cooling zones, each with its own airflow control. Instead of using a single rack-level fan system, the patent implements individual cooling canisters for each server slot, allowing segmented airflow management that prevents cross-contamination and reduces air leaks through rack passages.
Solution Approach 2:
The patent applies local quality by providing customized cooling solutions for each server slot based on its specific thermal requirements. Each slot-level cooling canister is independently controlled, allowing the airflow and cooling intensity to be tailored to the actual heat generation of individual servers, thereby reducing energy waste from uniform rack-level cooling.
2Temperature
If rack level fans are used to provide cooling, then cooling capacity is improved, but airflow distribution becomes uniform causing surplus cooling in some areas and inadequate cooling in others
Solution Approach 1:
The system segments the rack into multiple independent cooling zones at the slot level. Each cooling canister operates independently, allowing precise control of airflow to match the actual thermal needs of each server, eliminating the uniform airflow distribution problem of rack-level fans.
Solution Approach 2:
The patent implements dynamic airflow control at each slot level, where cooling intensity can be adjusted in real-time based on server workload and thermal conditions. This dynamic adjustment capability allows the system to optimize cooling distribution continuously, preventing both surplus and inadequate cooling scenarios.
3Temperature
If numerous small fans are mounted in individual computing systems, then cooling is provided at component level, but cooling efficiency decreases due to fan size and airflow interference
Solution Approach 1:
The patent merges multiple small fan functions into a single larger fan system at the slot level. By consolidating the cooling function from individual component fans to a shared slot-level fan, the system achieves higher cooling efficiency while maintaining adequate component-level cooling through the combined airflow capacity.
Solution Approach 2:
Instead of replicating multiple small fans in each computing system, the patent uses a copying approach where a single slot-level cooling canister design is replicated across multiple slots. Each canister provides focused cooling to its assigned servers, achieving component-level cooling effectiveness without the inefficiencies of multiple small fans.
4Reliability
If slot level thermal regulation systems are implemented, then airflow isolation between server subsets is improved, but device complexity increases
Solution Approach 1:
The patent segments the rack into multiple independent cooling zones using modular cooling canisters. Each canister provides airflow isolation for its assigned server subset, achieving reliable thermal management while maintaining manageable system complexity through standardized modular units.
Solution Approach 2:
The slot-level cooling canister design serves multiple functions: it provides airflow isolation, acts as a thermal regulation system, and can be replicated across different rack configurations. This multi-functionality reduces overall system complexity by using a universal modular component rather than custom solutions for each cooling zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency by ensuring that each subset of servers receives the appropriate airflow, reducing energy consumption, and minimizing air leaks, thereby improving the overall performance and reliability of the cooling system.
Implementation Method 1
A slot-level thermal regulation system may include a louver and a thermally responsive unit that changes dimension in response to changes in thermal energy
Implementation Method 2
The bi-metallic unit may be configured to bend, deviate laterally, deviate rotationally, or otherwise magnify the effect of thermal expansion of the bi-metallic unit in response to an increase in thermal energy
Implementation Method 3
The plurality of cooling canisters mounted in the rack at least include a particular cooling canister coupled with a particular subset of the plurality of servers and another cooling canister coupled with another subset of the plurality of servers such that the particular cooling canister and the other cooling canister are configured to facilitate air flow isolation between an air flow through the particular subset of servers and another air flow through the other subsets of servers
Implementation Method 4
The plurality of cooling canisters mounted in the rack at least include a fan coupled with each of the particular cooling canister and the other cooling canister, where the fan is configured to generate an air flow
Data Source
AI summary
A server rack comprises a plurality of slots and a plurality of computing devices. Individual ones of the computing devices are mounted within individual ones of the slots. The server rack also comprises a plurality of slot-level thermal regulation systems. At least one of the slot-level thermal regulation systems comprises a louver corresponding to a particular slot and located between a particular computing device mounted within the particular slot and at least one fan configured to facilitate airflow through the server rack. The louver is configured to regulate airflow through the particular computing device. The at least one slot-level thermal regulation system further comprises a thermally activated unit located in an exhaust flow of the particular computing device and configured to change the angle of the louver in response to a change in thermal energy of the exhaust flow.