Modular Air Cooling Device for Data Center Heat Dissipation
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Solution Overview
Problem
Current data center cooling solutions face challenges in efficiently dissipating heat from high-density computing equipment, leading to reduced reliability and increased energy consumption. Legacy air cooling systems are inadequate for modern data centers, while liquid cooling solutions are not feasible for all electronic devices.
Innovation Solution
A modular air cooling device and system that integrates an air cooling box with a heat exchange unit, allowing for efficient air circulation and heat exchange. This system can be deployed flexibly, combining with immersion liquid cooling devices to support a hybrid cooling approach, enabling efficient cooling of devices that cannot be cooled through liquid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling solution is adopted, then cooling efficiency is improved, but compatibility with existing electronic devices is reduced
Solution Approach 1:
The cooling system is divided into separate liquid cooling units and air cooling units that can be independently selected and combined. Each unit type can be deployed based on device compatibility requirements, allowing liquid cooling for compatible devices while maintaining air cooling for incompatible devices.
Solution Approach 2:
The cooling system is designed to support multiple cooling approaches (liquid cooling and air cooling) within the same data center infrastructure. The system can accommodate both cooling methods through standardized interfaces and modular units, providing universal cooling capability across different device types.
2Adaptability or versatility
If air cooling is used, then compatibility with existing devices is maintained, but cooling efficiency is insufficient for high-density computing
Solution Approach 1:
The data center is segmented into zones or racks that can use different cooling methods. High-density computing devices that require efficient cooling can be placed in liquid cooling zones, while other devices continue to use air cooling, allowing each segment to operate at optimal cooling efficiency.
Solution Approach 2:
Different cooling methods are applied to different locations based on local heat density requirements. Liquid cooling units are deployed locally at specific racks or device groups that generate high heat density, while air cooling serves other areas, creating locally optimized cooling quality throughout the data center.
3Adaptability or versatility
If legacy air cooling solutions are deployed, then device compatibility is maintained, but energy consumption increases and heat dissipation becomes inadequate
Solution Approach 1:
The system enables periodic assessment and transition of devices from air cooling to liquid cooling as compatibility is verified. Devices can be gradually migrated to more efficient cooling methods over time, allowing the data center to progressively reduce energy consumption while maintaining compatibility with existing devices.
Solution Approach 2:
The cooling system allows changing the cooling method parameter for individual devices or racks from air cooling to liquid cooling based on heat density and compatibility assessment. This parameter change enables optimization of energy consumption without requiring complete system replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular air cooling device provides efficient heat dissipation for electronic devices, improving system reliability and reducing energy consumption. The hybrid cooling approach enhances compatibility and flexibility, allowing for scalable deployment and reduced costs, ultimately contributing to carbon neutrality.
Implementation Method 1
a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger to cool air flowing through the heat exchange
Implementation Method 2
the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices
Data Source
AI summary
The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices; and a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger.