Immersion Cooling Weir and Handle for Dielectric Fluid Management

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Solution Overview

Problem

Traditional computing and server systems rely on air cooling, which is inefficient and space-consuming, while traditional liquid cooling systems avoid direct contact between components and liquid, limiting their effectiveness in immersion cooling.

Innovation Solution

A liquid immersion cooling system with an adjustable weir mechanism that allows for efficient transfer of dielectric fluid between a bath area and a sump area, enabling direct heat transfer from computing components to the fluid, and incorporating a multifunctional handle for compute devices that provides cable management, acts as a heat sink, and identifies devices without contaminating the fluid.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional air cooling is used for computing components, then the system is simple to implement, but cooling efficiency is poor and space requirements are large

Engineering Contradiction:
Improveease of implementationVSAvoidcooling efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent implements immersion cooling by submerging computing components directly in dielectric fluid, replacing traditional air cooling mechanisms. The fluid circulation system with pumps, heat exchangers, and filtration enables efficient heat transfer from components to fluid, achieving superior cooling performance while maintaining system simplicity through direct liquid-to-component contact

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Reliability

If traditional liquid cooling systems are used that avoid direct contact between components and liquid, then electrical safety is maintained, but cooling effectiveness is limited

Engineering Contradiction:
Improveelectrical safetyVSAvoidcooling effectiveness
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the electrical parameter of the cooling liquid by using dielectric fluid instead of conductive water-based liquids. This parameter change allows direct immersion of electrical components in the liquid while maintaining electrical safety, enabling both high cooling effectiveness through direct contact and electrical isolation to prevent short circuits

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If a fixed weir is used between bath area and sump area, then the structure is simple, but the system cannot adapt to varying fluid levels and temperatures

Engineering Contradiction:
Improvestructural simplicityVSAvoidadaptability to varying conditions
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent replaces the fixed weir structure with an adjustable weir that can be repositioned vertically along the tank wall. This dynamic adjustment capability allows the system to adapt to varying fluid levels and temperature conditions by changing the weir height, optimizing fluid circulation patterns and heat exchange efficiency for different operating scenarios

Inventive Principle:
Principle #15Dynamics

4Device complexity

If compute devices are handled directly without specialized mechanisms, then the device structure is simple, but fluid contamination risk increases and heat dissipation is reduced

Engineering Contradiction:
Improvedevice structureVSAvoidfluid contamination
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a specialized handle as an intermediary component between the operator and the compute device. This handle serves multiple functions: providing a grip point above the fluid level to prevent contamination, acting as a heat sink to dissipate heat from the device, and enabling safe handling without direct contact between hands and dielectric fluid

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves efficient and effective cooling of computing components by directly transferring heat from components to the dielectric fluid, reducing energy consumption and space requirements, while the multifunctional handle enhances handling, cooling, and identification of compute devices.

Implementation Method 1

enabling direct heat transfer from computing components to the fluid

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a central reservoir comprising a heat exchanger for cooling a dielectric fluid

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20250185205A1Liquid Immersion Cooling Platform with an Adjustable Weir and Multifunctional Compute Device Handles
Publication Date: 2025.06.05 MODINE LLC
  • US20250185205A1 patent drawing
  • US20250185205A1 patent drawing
  • US20250185205A1 patent drawing

AI summary

An immersion cooling system and methods for operating the system are described. The system can comprise a vessel which can be configured to hold a thermally conductive dielectric fluid; a computer component which can be configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system which can be configured to draw the dielectric fluid from a sump area of the vessel, pass the dielectric fluid through a filter and deliver the dielectric fluid to a bath area of the vessel. In one example embedment, there can be an adjustable weir between the bath area and the sump area. Multifunctional handles are also described.