Sliding Copper Foil Thermal Path for Network Control Automation
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Solution Overview
Problem
Industrial automation systems face challenges in heat dissipation due to increasing temperatures of components like FPGA chips, CPUs, and chipsets, which can lead to system instability and reduced efficiency, especially in high-performance, compact designs.
Innovation Solution
A thermal conducting structure is implemented using copper foil layers on a circuit board that slidably mount along sliding edges of an outer shell member, forming a thermal conducting path to enhance heat dissipation, with additional heat conducting modules and thermal mediums to increase the overall heat dissipation area and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If copper foil layers are slidably mounted along sliding edges to increase heat dissipation area, then heat dissipation efficiency is improved, but the structure complexity increases
Solution Approach 1:
The copper foil layers are integrated with the circuit board structure, merging the heat dissipation function with the existing structural components. The copper foils are embedded within grooves of the circuit board, combining structural support and thermal conduction functions into a single integrated component, thereby improving heat dissipation without proportionally increasing overall structure complexity
Solution Approach 2:
The heat dissipation structure extends into the third dimension by incorporating copper foil layers at multiple levels within the circuit board thickness. The grooves and embedded copper foils create a multi-layered thermal conduction path that utilizes vertical space, effectively increasing heat dissipation area without significantly increasing the horizontal footprint of the device
2Ease of operation
If the outer shell member is pushed to move inwardly to receive the circuit board, then assembly ease is improved, but the positioning precision may be affected
Solution Approach 1:
The copper foil layers are pre-positioned within grooves of the circuit board before assembly, and the outer shell member is designed with predetermined grooves and sliding edges. This preliminary structuring ensures that when the assembly motion occurs, the components align and lock into their correct positions automatically, maintaining precision while enabling easy assembly
Solution Approach 2:
The sliding edges and grooves act as intermediary structures that guide the circuit board into proper positioning during assembly. These intermediary features provide mechanical guidance and constraint, ensuring that the simple push-in motion results in precise final positioning of the circuit board within the outer shell member
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat dissipation area and efficiency, ensuring stable operation of industrial automation systems by efficiently conducting heat away from heat sources, while also protecting components from damage and improving the smooth sliding of copper foil layers to prevent insulation damage.
Implementation Method 1
the copper foil layers of the circuit board are abutted and mounted with the sliding slot formed inside the sliding edges to form thermal conducting path to conduct heat
Data Source
AI summary
A thermal conducting structure applied to a network control automation system includes a circuit module and a heat dissipation structure. Copper foil layers are horizontally disposed on bare copper regions disposed at top and bottom sides of circuit board. An outer shell member includes side panels disposed at top and bottom sides, and each side panel defines a track member comprising a sliding edge. The copper foil layers can be slidably mounted along sliding edges, and outer shell member is pushed to inwardly move relative to circuit board, then circuit board is positioned in accommodation open chamber formed between outer shell member and two side panels. While assembling, copper foil layers are abutted and mounted with sliding slots, forming thermal conducting path. Heat generated by heat source can be conducted to heat dissipation structure through two copper foil layers, to increase heat dissipation area and improve heat dissipation efficiency.