Molded Thermal Plastic Fin Shell for Electronic Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat sink designs for electronic devices face challenges in efficiently dissipating heat generated within small enclosures, particularly due to insufficient thermal conductivity and complex manufacturing processes.
Innovation Solution
A heat sink design incorporating a molded thermal plastic fin shell with high thermal conductivity, combined with metal components, which allows for efficient heat dissipation from electronic components to the surrounding air while simplifying manufacturing and reducing weight and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional plastic materials are used for heat sink components, then manufacturing cost and ease of manufacture are improved, but thermal conductivity and heat dissipation efficiency deteriorate
Solution Approach 1:
The patent employs composite materials by integrating metal heat sink components (high thermal conductivity) with molded plastic housing (ease of manufacture, cost-effectiveness). This combination allows the metal components to provide efficient heat dissipation pathways while the plastic housing provides manufacturable structural support and thermal management integration, resolving the contradiction between manufacturing ease and heat dissipation efficiency
Solution Approach 2:
The patent changes the thermal conductivity parameter of the plastic material by selecting specific plastic formulations with enhanced thermal properties. By modifying the material parameters (choosing plastics with higher thermal conductivity ratings), the system achieves improved heat dissipation efficiency while maintaining the manufacturing advantages of plastic materials
2Reliability
If metal heat sink components are used, then thermal conductivity and heat dissipation efficiency are improved, but weight and manufacturing cost increase
Solution Approach 1:
The patent segments the heat sink system into distinct metal and plastic components. The metal components are strategically placed only where high thermal conductivity is critical (direct contact with heat-generating electronics), while the plastic housing provides structural support and additional thermal management. This segmentation reduces overall metal usage and weight while maintaining effective heat dissipation
Solution Approach 2:
By creating a composite structure that combines metal and plastic materials, the patent achieves optimal weight distribution. The metal portions provide necessary thermal conductivity only where required, while the lighter plastic material constitutes the majority of the housing structure, thereby reducing overall weight while maintaining thermal performance
3Reliability
If heat sink design increases surface area for heat dissipation, then heat dissipation efficiency is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the heat dissipation function with the structural housing function by integrating heat sink components directly into the molded plastic housing. The plastic housing itself becomes part of the thermal management system, with integrated fins or heat dissipation structures. This merging eliminates the need for separate, complex heat sink assemblies while achieving effective heat dissipation through the unified structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of thermal plastic and metal materials enhances heat dissipation efficiency, reduces the need for fans, and results in a smaller, lighter, and more reliable electronic device with improved cooling performance without affecting electronic performance.
Implementation Method 1
The thermal plastic material has a relatively high thermal conductivity in comparison to conventional plastic materials. The relatively high thermal conductivity of the thermal plastic material is closer to a thermal conductivity of the metal heat sink component than to an average thermal conductivity of conventional plastic materials.
Implementation Method 2
A heat sink is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. The fin shell composed of a thermal plastic material and comprising a plurality of fins across an external surface of the fin shell.
Data Source
AI summary
Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.