Controller Placement Between Memory Stack and Interposer
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Solution Overview
Problem
Existing semiconductor device packages face challenges such as increased cost, manufacturability issues, and reliability concerns due to the placement of controller elements relative to non-volatile memory devices, including difficulties with cavity depth, dielectric film adhesion, and wire bond deformation, which affect electrical integrity and area efficiency.
Innovation Solution
A semiconductor device package design where a controller element is positioned between a stack of semiconductor memory devices and an interposer substrate, with a redistribution substrate laterally adjacent to the controller element, routing data for convenient connection to bond pads and reducing manufacturing complexity through simplified wire bonding and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the controller element is embedded within the interposer substrate, then the controller is securely integrated, but the substrate cost increases and cavity depth control becomes difficult
Solution Approach 1:
The patent introduces a dielectric film as an intermediary layer between the controller element and the interposer substrate. This dielectric film serves as a mediator that facilitates the integration of the controller while avoiding the need for complex cavity structures in the substrate, thereby reducing substrate cost and simplifying manufacturing processes.
Solution Approach 2:
Instead of embedding the controller within the substrate thickness (vertical dimension), the patent positions the controller on the substrate surface and uses a dielectric film to cover and integrate it. This shifts the integration approach from a vertical embedding to a lateral surface mounting with overhead coverage, simplifying cavity depth requirements.
2Reliability
If the controller element is placed between the stack and the interposer substrate, then wire bond length is reduced, but dielectric film may squeeze out during assembly
Solution Approach 1:
The patent modifies the dielectric film parameters by providing it with a thickness greater than the controller element thickness and extending it beyond the controller boundaries. This parameter adjustment prevents the film from squeezing out during assembly while maintaining electrical integrity, as the excess film material accommodates the controller volume and provides overflow margins.
Solution Approach 2:
The dielectric film is designed with excess thickness and lateral extension before assembly occurs. This beforehand cushioning of material ensures that during the stacking and curing process, the film has sufficient material reserve to accommodate compression and deformation without exposing wire bonds or creating voids.
3Area of stationary object
If the controller element is placed over the stack of non-volatile memory devices, then area is saved, but wire bonds may deform during encapsulation
Solution Approach 1:
Instead of placing the controller on top of the stack (which would require long wire bonds extending upward), the patent inverts the arrangement by placing the controller on the interposer substrate below the stack. This inversion shortens the wire bond paths and repositions the controller to a more stable location that reduces mechanical stress on wire bonds during encapsulation.
4Reliability
If the controller element is placed adjacent to the stack of non-volatile memory devices, then wire bond length is reduced, but package area increases
Solution Approach 1:
The patent merges the controller element placement with the interposer substrate structure, positioning the controller on the substrate in a location that serves dual purposes: shortening wire bond paths to the stack while maintaining compact package dimensions. The controller is integrated into the substrate area rather than occupying additional lateral space.
Data Source
AI summary
Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.