Wavelength Converter Adhesive Layout for Higher Light Extraction
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Solution Overview
Problem
In optoelectronic devices, the adhesive used to fix converters to the top surface of semiconductor components often covers non-emissive areas, leading to absorption of backscattered light, which reduces light extraction efficiency.
Innovation Solution
The converter is arranged centered above the light emitting surface with a contour line that projects entirely within the light emitting surface, and the adhesive is placed only on the light emitting surface, avoiding non-emissive areas, thus preventing absorption of backscattered light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive is applied to fix the converter to the top surface of the semiconductor component, then the converter is securely fixed, but the adhesive covers non-emissive areas and absorbs backscattered light, reducing light extraction efficiency
Solution Approach 1:
The adhesive is applied selectively only to the light emitting surface area, creating a local quality distinction where the adhesive coverage is concentrated precisely where light is emitted from the semiconductor component. This localized application ensures secure fixing of the converter while avoiding coverage of non-emissive peripheral areas that would otherwise absorb backscattered light and reduce light extraction efficiency
2Loss of energy
If the converter is arranged centered above the light emitting surface with a smaller footprint, then adhesive can be confined to the light emitting surface, but the converter structure becomes more complex
Solution Approach 1:
The converter is designed with a stepped three-dimensional structure featuring different height levels. The first converter portion extends to a first height level while the second converter portion extends to a second height level that is lower than the first. This dimensional variation allows the converter to maintain a centered arrangement above the light emitting surface with appropriate footprint dimensions, enabling adhesive confinement to the light emitting surface while managing structural complexity through vertical differentiation rather than horizontal expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the light extraction efficiency of the optoelectronic device by minimizing the coverage of adhesive on non-emissive areas, enhancing luminous efficiency and brightness.
Implementation Method 1
a converter (27) which is arranged centered above the light emitting surface (23) and is configured for converting the generated light into converted light having at least one other wavelength
Implementation Method 2
an adhesive (29) for fixing the converter (27) to the top surface (25) of the semiconductor component (21)
Implementation Method 3
The non-emissive areas of the top surface covered with adhesive absorb incident light
Data Source
AI summary
An optoelectronic device includes an optoelectronic semiconductor component having an active region configured to generate light and having a light emitting surface through which the generated light is emittable from the semiconductor component, the light emitting surface being arranged on a top surface of the semiconductor component, a converter centered above the light emitting surface and configured to convert the generated light into converted light of at least one other wavelength and an adhesive fixing the converter to the top surface of the semiconductor component, wherein a contour line, projected onto the top surface of the semiconductor component, completely circumvents the converter in a circumferential direction and lies completely within the light emitting surface, wherein the adhesive is arranged between the light emitting surface and the converter and/or in the circumferential direction around the converter.