Power Converter Heat Dissipation Plate Layout for Capacitor Cooling

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Solution Overview

Problem

Conventional capacitors experience high thermal resistance, leading to increased temperature rise in the capacitor element due to inefficient heat dissipation through the lead terminal and electrode plate.

Innovation Solution

A power conversion device is designed with a case containing first and second heat dissipation plates, a sealing material, and a printed wiring board, where the heat dissipation plates are arranged to maximize heat transfer and the sealing material fills the spaces between them, effectively dissipating heat from the capacitor element to the outside.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If heat is transferred through the lead terminal and electrode plate to the lid body, then the capacitor structure is simple, but the thermal resistance is high and temperature rise increases

Engineering Contradiction:
Improvecapacitor structureVSAvoidtemperature rise in capacitor element
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation plate as an intermediary component between the capacitor element and the lid body. The heat dissipation plate has a larger surface area than the electrode plate, allowing it to act as an effective heat transfer mediator that reduces thermal resistance and dissipates heat more efficiently from the capacitor element.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat dissipation plate extends in a direction orthogonal to the first direction (the direction from capacitor element to lid body), creating an additional heat dissipation dimension. This dimensional extension increases the heat dissipation surface area and provides alternative heat transfer paths, reducing the thermal resistance in the original heat transfer direction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If multiple heat dissipation plates are arranged in orthogonal directions, then heat dissipation efficiency is improved, but the device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat dissipation plate arrangement
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation function is segmented into multiple independent heat dissipation plates arranged in orthogonal directions. Each plate handles heat dissipation in a specific direction, and the segmentation allows for modular assembly and maintenance while achieving comprehensive heat dissipation coverage through the orthogonal arrangement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation plates serve multiple functions: they act as heat transfer conduits from the capacitor element, provide structural support within the case, and create spacing for sealing material. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity despite the orthogonal arrangement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly suppresses the temperature rise in circuit components, extending their lifespan and improving the overall performance of the power conversion device by providing an efficient heat transfer path.

Implementation Method 1

heat generated in the capacitor element is transferred through the lead terminal and the electrode plate to the lid body, and dissipated from a protrusion of the lid body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240422952A1Power Conversion Device
Publication Date: 2024.12.19 MITSUBISHI ELECTRIC CORP
  • US20240422952A1 patent drawing
  • US20240422952A1 patent drawing
  • US20240422952A1 patent drawing

AI summary

A power conversion device includes: a case having a side wall and a bottom wall; a plurality of first heat dissipation plates, a plurality of second heat dissipation plates, a plurality of circuit components and a sealing material that are disposed in the case; and a printed wiring board electrically connected to the plurality of circuit components and attached to the case. An inner wall surface of the bottom wall has a normal along a first direction. The plurality of first heat dissipation plates each extend in a second direction orthogonal to the first direction, and are spaced from one another and arranged in a third direction orthogonal to the first direction and the second direction. The plurality of second heat dissipation plates each extend in the third direction, and are spaced from one another and arranged in the second direction.