Conversion Constructional Details TRIZ Cases
- Power Converter Heat Dissipation Plate Layout for Capacitor Cooling
Orthogonal heat dissipation plates and sealing material cut capacitor thermal resistance and suppress temperature rise in power converters.
- Three-Module Inverter Layout for Compact 3-Level Power Units
A three-module Y-shaped inverter package fits compact 3-level power units while circulation buses balance parallel currents and prevent damage.
- Multilevel Converter Short-Circuit Detection via Current Signal Patterns
Collective current signals from power modules are matched to a fault table to detect short circuits and locate the affected path with fewer sensors.
- Power Module Board Retention Layout for Vibration-Resistant Packaging
A resin board retention member supports module terminals through the board while cutting package size, mounting area, and fixation cost.
- Parallel Power Converter Layout for Inductance Equalization
Alternating adjacent DC and AC terminals across parallel circuit bodies cancels magnetic fields to cut inductance, surge voltage, and losses.
- Inverter Cooler Channel Structure for Uniform Module Cooling
Varying cooling structure density along the inverter cooler channel balances module heat absorption while limiting pressure loss and pump energy.
- Modular Photovoltaic Inverter Layout With Shared Filtering and Cooling
Shared LLC filtering and independent cooling circuits shrink modular solar inverters, cut overheating losses, and simplify power-cell replacement.
- Switching Cell Connecting Structure for Low-Stray-Inductance Layout
An offset connecting part and covering part bridge separated tabs to compensate magnetic fields, cut stray inductance, and avoid short circuits.
- Heat Sink-Integrated Current Sensor for Accurate Compact Monitoring
Embedding the current sensor in the heat sink saves installation space and reduces heat-related measurement errors in power electronics.
- Delta MMC STATCOM Using Anti-Series Half-Bridge Submodules
A delta-connected MMC STATCOM uses anti-series half-bridge submodules to supply reactive power without costly dual-polarity full-bridge modules.
- Optical Fiber Temperature Sensing on Semiconductor Main Electrodes
An insulated optical fiber bonded to a semiconductor main electrode enables accurate temperature sensing at high potential without thermocouple safety risks.
- Busbar Module Layout for Capacitor Thermal Isolation
A protruding fixed portion and molded resin keep the busbar away from the capacitor, reducing heat transfer in power converters.
- Power Semiconductor Module Terminal Layout for Accurate Current Sensing
A terminal layout uses the main current path as an inductor to improve current measurement accuracy without enlarging the power module.
- Delta Multilevel Converter Using Half-Bridge Submodule Groups
A delta multilevel converter splits submodules by polarity, using lower-cost half-bridge cells to deliver controllable reactive power.
- Cable-Free Inverter Connector Structure for Stable PCB Contact
A flat connecting plate links the inverter conductive core directly to the circuit board, simplifying installation while reducing contact resistance and heat.
- Switching Cell Connector Layout for Low-Stray-Inductance DC Links
An offset covering connector bridges the tab gap to balance magnetic fields, cut stray inductance, and secure DC link connections.
- Semiconductor Module Gate Wiring Geometry for Uniform Gate Voltage
Varying signal wiring cross-sections balance gate path differences to equalize gate voltage, cut switching delays, and suppress wiring loss.
- Metal Clip Structure for Power Module Chip Alignment and Heat Dissipation
Pressing grooves and stepped bonding parts keep power module chips aligned during soldering while improving heat dissipation and assembly stability.