Optical Fiber Temperature Sensing on Semiconductor Main Electrodes
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Solution Overview
Problem
Existing methods for measuring the temperature of semiconductor elements in semiconductor devices are inaccurate and unsafe, as they often rely on average thermal energy loss estimation, separate thermal measurement samples, or direct thermocouple attachment, which can lead to incorrect temperature readings and safety concerns.
Innovation Solution
A semiconductor device and temperature measurement method utilizing an optical fiber with an insulating cable unit and a temperature measurement unit bonded to the semiconductor element's main electrode using a high-thermal-conductivity bonding material, allowing for precise and safe temperature measurement based on changes in light output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a thermocouple is directly attached to the semiconductor element for temperature measurement, then temperature measurement capability is achieved, but safety concerns arise due to electrical potential differences
Solution Approach 1:
The patent introduces an optical fiber as an intermediary medium between the temperature measurement device and the semiconductor element. The optical fiber transmits light signals to and from the measurement point without direct electrical contact, thereby enabling temperature measurement while maintaining electrical isolation and safety. The optical fiber acts as a mediator that transfers thermal information without creating electrical connection risks.
2Ease of operation
If thermal measurement is performed using average thermal energy loss estimation, then measurement simplicity is maintained, but measurement accuracy deteriorates
Solution Approach 1:
The patent replaces the indirect thermal energy loss estimation method with a direct optical-based temperature measurement system. By using an optical fiber with a temperature-sensitive element that directly contacts the semiconductor surface, the system substitutes complex thermal modeling with direct optical measurement, achieving both accuracy and operational simplicity.
3Reliability
If separate thermal measurement samples are used instead of direct measurement on semiconductor elements, then safety is improved, but measurement accuracy deteriorates
Solution Approach 1:
The optical fiber serves as a safe intermediary that enables direct measurement on the actual semiconductor element without electrical contact risks. This eliminates the need for separate measurement samples while maintaining safety through optical isolation, thereby achieving both accurate in-situ measurement and operator safety.
4Reliability
If optical fiber with insulating properties is used for temperature measurement, then safety and electrical isolation are achieved, but device complexity increases
Solution Approach 1:
The optical fiber cable performs multiple functions simultaneously: it provides mechanical support for the temperature measurement probe, ensures electrical isolation through its insulating properties, and transmits optical signals for temperature detection. This multi-functionality reduces the need for separate components and simplifies the overall device structure despite the advanced measurement technique used.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and safe measurement of semiconductor element temperatures, even at high potentials, improving thermal design and operational stability by directly measuring surface temperatures without interfering with the semiconductor elements.
Implementation Method 1
a cable unit composed of an optical fiber with insulating properties and a temperature measurement unit provided on a leading end of the cable unit
Implementation Method 2
measuring the temperature of the semiconductor element on a basis of a change in an output of the temperature measurement unit
Implementation Method 3
a leading end of the temperature measurement unit is bonded to the main electrode using a bonding material
Data Source
AI summary
A semiconductor includes a multilayer substrate including an insulating plate and a plurality of circuit boards disposed on a top face of the insulating plate, a semiconductor element disposed on a top face of one of the plurality of circuit boards, and having a main electrode disposed on a top face thereof, and a temperature measurement device for measuring a temperature of the semiconductor element. The temperature measurement device includes a cable unit composed of an insulated optical fiber, and a temperature measurement unit provided on one end of the cable unit, the temperature measurement unit being bonded to the main electrode of the semiconductor element using a bonding material.