Parallel Power Converter Layout for Inductance Equalization
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Solution Overview
Problem
Conventional power conversion devices have insufficiently equalized inductance due to unbalanced inductance of each mounted chip, which affects switching speed and surge voltage reduction.
Innovation Solution
A power conversion device with a substrate featuring DC and AC wiring, where circuit bodies with adjacent first and second terminals are alternately arranged, reducing inductance by canceling magnetic fields generated by currents flowing in opposite directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If circuit bodies are arranged with symmetric upper and lower arm circuits and alternating positive and negative terminals, then wiring structure is simplified, but inductance cannot be sufficiently reduced due to unequalized inductance of each mounted chip
Solution Approach 1:
The patent applies asymmetry by arranging circuit bodies such that terminals of the same polarity are positioned at different locations. Specifically, first terminals (positive) and second terminals (negative) are arranged alternately but not symmetrically, with intentional position offsets that create asymmetric current paths. This asymmetric arrangement, combined with specifically designed wiring patterns, enables more effective inductance reduction by equalizing the total inductance across different chip mounts while maintaining simplified wiring structure.
2Device complexity
If inductance of each mounted chip is assumed to be equal, then design is simplified, but actual inductance varies causing insufficient surge voltage reduction
Solution Approach 1:
The patent applies local quality by making each circuit body's terminal arrangement and wiring pattern unique according to its specific location on the substrate. Instead of using identical symmetric patterns for all circuit bodies, the design adjusts the wiring paths and terminal positions locally for each circuit body to compensate for variations in chip inductance. This localized customization of wiring structures ensures that the total inductance is equalized across all parallel-connected circuit bodies, effectively reducing surge voltage without requiring complex global redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces inductance from 5 nH to 2 nH per circuit body, improving switching speed and reducing surge voltage and losses.
Implementation Method 1
reducing inductance by canceling magnetic fields generated by currents flowing in opposite directions
Data Source
AI summary
A power conversion device includes a substrate on which DC wiring and AC wiring are formed, and a plurality of circuit bodies that are electrically connected in parallel and have a first terminal and a second terminal each connected to the DC wiring or the AC wiring. The first terminals and the second terminals are adjacent to each other in the circuit bodies and protrude in a same direction, and the plurality of circuit bodies are disposed such that the first terminals and the second terminals are alternately arranged side by side on the substrate.