Power Semiconductor Module Terminal Layout for Accurate Current Sensing
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Solution Overview
Problem
The existing power semiconductor modules face challenges in miniaturization due to the need for increased inductance in the main current path for accurate current measurement, which requires longer metal layers or additional bonding wires, leading to increased module size and potential decreases in measurement accuracy due to temperature changes.
Innovation Solution
The power semiconductor module design incorporates a detection terminal configuration where a portion of the main terminal functions as the inductor, allowing for increased inductance without the need for additional metal layers or bonding wires, facilitating miniaturization and reducing temperature-induced inductance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the length of the metal layer on the insulating substrate is increased to increase inductance, then the inductance increases, but the size of the power semiconductor module becomes large
Solution Approach 1:
The patent merges the function of the main terminal with the inductor function. The main terminal itself is configured to serve as the inductor in the main current path, eliminating the need for separate inductor structures. This is achieved by designing the main terminal with specific geometric features (such as extended portions or loop structures) that provide the required inductance while maintaining its primary function as an electrical connection point.
Solution Approach 2:
The main terminal is designed to perform multiple functions simultaneously: it serves as both the electrical connection terminal and the inductor. This multi-functional design allows the same structure to provide both electrical connectivity and the necessary inductance for accurate current measurement, thereby avoiding additional space requirements.
2Measurement precision
If additional metal layers or bonding wires are provided to increase inductance, then the inductance increases, but the device complexity increases
Solution Approach 1:
The patent combines the inductor function with the existing main terminal structure, eliminating the need for additional metal layers or bonding wires. The main terminal is designed with integrated geometric features that provide the required inductance, thereby simplifying the overall structure and reducing manufacturing complexity.
3Measurement precision
If the length of the bonding wire is increased to increase inductance, then the inductance increases, but the module size becomes large
Solution Approach 1:
The patent eliminates the need for extended bonding wires by integrating the inductor function directly into the main terminal. The main terminal is configured with geometric features (such as extended portions forming loops or meander patterns) that provide the necessary inductance without requiring additional bonding wire length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the miniaturization of the power semiconductor module while maintaining measurement accuracy and reducing the impact of temperature changes on inductance, thereby improving the module's overall performance.
Implementation Method 1
an inductance of a certain size or more is required in the main current path between the two detection terminals
Data Source
AI summary
A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer on a surface of the insulating substrate; a semiconductor chip including an upper electrode and a lower electrode, the upper electrode being electrically connected to the first metal layer, the lower electrode being electrically connected to the second metal layer; a first main terminal including a first end and a second end, the first end being electrically connected to the first metal layer; a second main terminal including a third end and a fourth end, the third end being electrically connected to the second metal layer; a first detection terminal being electrically connected between the first end and the second end of the first main terminal; and a second detection terminal being electrically connected to the first metal layer.