Convex Heat Spreader Geometry for Air-Free Thermal Interfaces
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Solution Overview
Problem
There is a growing demand for improving the efficiency of heat transfer from semiconductor chips to heat sinks due to increased heat generation, and existing heat spreaders are inadequate in effectively managing this transfer.
Innovation Solution
A heat spreader design featuring a flat portion with two convex portions projecting from opposite sides, each with curved surfaces, and a method of manufacturing using cemented carbide molding parts to shape a metal plate into this configuration, ensuring efficient air removal from thermal interface materials for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional flat heat spreader is used, then the structure is simple and easy to manufacture, but air entrapment occurs in thermal interface materials reducing heat transfer efficiency
Solution Approach 1:
The heat spreader incorporates convex portions with curved surfaces that project from the flat surface. These curved surfaces enable air entrapment removal from the thermal interface material during assembly, directly addressing the heat transfer efficiency problem while maintaining manufacturability through standard forming processes
2Ease of manufacture
If the heat spreader surface is made completely flat, then manufacturing is easier, but air cannot be effectively removed from thermal interface material
Solution Approach 1:
The heat spreader maintains a generally flat surface for ease of manufacture while introducing localized convex portions with curved surfaces. These localized features serve the specific function of air entrapment removal without compromising the overall flatness or manufacturing simplicity of the heat spreader body
3Reliability
If convex portions are added to the heat spreader, then air entrapment is reduced improving heat transfer, but manufacturing complexity increases
Solution Approach 1:
The convex portions are designed with smooth curved surfaces that can be formed using standard metal forming or machining processes. This curvature design achieves air entrapment removal functionality while maintaining compatibility with conventional manufacturing methods, limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively improves heat transfer efficiency by minimizing air entrapment in thermal interface materials, allowing for wider heat diffusion and improved thermal conductivity between the semiconductor chip and heat sink.
Implementation Method 1
The design effectively improves heat transfer efficiency by minimizing air entrapment in thermal interface materials
Implementation Method 2
Heat spreaders are used to transmit heat generated in semiconductor chips to heat sinks
Implementation Method 3
allowing for wider heat diffusion and improved thermal conductivity between the semiconductor chip and heat sink
Data Source
AI summary
A heat spreader includes a flat portion having a first flat surface and a second flat surface opposite the first flat surface, a first convex portion surrounded by the first flat surface and projecting from the first flat surface to a side opposite the second flat surface, and a second convex portion surrounded by the second flat surface and projecting from the second flat surface to a side opposite the first flat surface.