Cooling/Ventilation/Heating Modifications TRIZ Cases

Notched fins create recessed passageways that lower dielectric liquid flow resistance while preserving dense heat-transfer area in immersion cooling.

Separating indoor heat-exchange rods from the outdoor condenser frees data hall space while maintaining coolant-refrigerant heat exchange.

Sensors in an in-rack manifold track coolant conditions to detect leaks, blockages, and failures early, enabling isolation and safe shutdown.

Separate air conduits reconcile ETSI side-to-side airflow with effective cooling of optical transceivers, boosting capacity and lowering power use.

Configurable nozzles and manifold channels direct coolant to each hardware position, improving hotspot control while limiting energy use.

Housing panels with embedded coolant channels remove heat from direct-contact coolant loops to handle high server and AI component heat loads.

A plate evaporator switches between refrigerant and cooling water to handle high thermal loads with less added equipment, space, and cost.

Sensors in an in-rack coolant manifold detect leaks, blockages, and failures early, enabling isolation and controlled shutdown of affected sections.

A single heat transfer member with height adjustment portions cools uneven substrate components while cutting solder joints, parts, and build complexity.

A sealed air-circulation heat exchanger cools server containers without outside air, limiting dust, humidity, corrosion, and condensation.

A coil-driven vortex in ferrofluid coolant boosts tube-wall turbulence and convective heat transfer without raising overall flow rate.

Curved convex features on both sides of a heat spreader displace trapped air in thermal interface materials and improve chip-to-sink heat transfer.

A rotating quick-connect mechanism isolates leaking liquid-cooling lines in rack-mounted chassis to protect hardware and maintain service.

A moisture-blocking cover with drain grooves and finned airflow channels keeps water off the PCB while preserving forced convection cooling.

A guided drain structure and localized moisture protection help liquid-cooled vehicle electronics avoid PCB short circuits and migration.

A T-shaped elastic part spreads clamping loads and absorbs vibration to prevent plastification in electric power converters.

Insulating coolant sealed inside converter submodule housings cools active parts directly, raising power density without complex external liquid loops.

A detachable cover and hollow pillar let seawater cool submerged data center servers while preserving operator access for maintenance.

Separated internal and external airflow paths cool the display through a heat exchanger while keeping dust and moisture out of the enclosure.

A three-loop cooling architecture combines vapor chamber two-phase flow, cold plate cooling, and immersion cooling to handle high-power chips with lower PUE.

A flexible dielectric-coolant container adapts to electronic object size and shape, cutting excess volume while improving heat exchange.

Integrated manifolds and a cold-plate radiator layout remove pipe airflow blockage, improving refrigerant cooling for heat-generating electronics.

Movable fluid structures redirect coolant and eject vapor bubbles to prevent dryout and improve cooling under changing chip heat loads.

A spring-like channel projection keeps the heat sink uniformly pressed to the power module, improving coolant heat transfer and lowering thermal resistance.

A rod-based heat exchanger moves heat from tightly packed processing units to an outdoor exchanger, freeing data hall space while maintaining cooling.

Variable wavy fin wavelengths balance heat removal and pressure drop in liquid-cooled plates for high-speed power chips.

Vertical insertion slots, guides, and switch-coupled ports automate immersion server module assembly without manual cable plugging.

Ceiling fans and side cooling units recirculate thermally separated air to improve data center cooling uniformity without using floor space.

By moving cooling units to the cabinet front or rear, this case frees internal space, simplifies server maintenance, and supports liquid and air cooling.

Overhead fans and side cooling units recirculate thermally separated air to free floor space, reduce hot spots, and improve rack layout flexibility.

A dual-flow vapor chamber uses fast and slow cooling regions with a piezoelectric pump to cool concentrated heat sources in thin foldable electronics.

A parallel bleed-in reservoir removes entrained gas and absorbs coolant expansion in AIO liquid cooling without disturbing main-loop pressure.

Using cabinet dead space, this layout adds a heat exchanger to each rack to cut plumbing length, reduce refrigerant use, and isolate failures.

A welded one-piece heat sink and flow channel structure cuts leakage risk, thermal resistance, volume, and weight in multi-module cooling.

A partitioned tank with staged flow openings stabilizes liquid level and pressure sensing while keeping bubbles out of the pump.

Dielectric liquid immersion cooling handles rising thermal design power in computing platforms while reducing air-cooling limits and thermal risk.

A floating connector with O-ring grooves and tube clearance maintains a fluid-tight seal despite axial and angular misalignment.

Plenum separators and an inlet impedance element curb failed-fan air recirculation, helping servers stay within thermal limits.

Gradually tapered inlet and outlet tubes cut coolant pressure drop in a cold plate, improving server component heat removal.

Stacked sintered porous metal structures create fluid flow passages that boost heat exchange in compact cooling units for high-heat components.

Reversing coolant flow through the cold plate dislodges debris for in-place cleaning, reducing downtime and avoiding disassembly.

A fan-sized coolant manifold box adds liquid cooling to dense network elements, keeping pluggable optics below critical temperatures in 1RU layouts.

Bellows nested inside the tank head space cut operating fluid volume and system bulk in immersion cooling hardware.

Separate air ducts and heat exchangers cool the sensor and electronics quickly while preserving space for image stabilization.

Hermetically sealed cooling cartridges combine electronics and fluid handling to simplify liquid-cooling service, standardize maintenance, and cut costs.

Tool-free fan module alignment and locking shortens liquid-cooling cabinet maintenance while preserving high heat dissipation for CPUs and GPUs.

Co-located pleated filters at each cold plate capture smaller particles while reducing pressure drop and protecting micro-channel cooling.

A sliding inner bracket aligns or blocks vents to regulate cold-side airflow and keep network interface cards within rated temperatures.

Acoustic wave generators vibrate immersion liquid to cut boundary layers, boost turbulence, and cool datacenter server racks with less piping.

Real-time sensors and predictive maintenance pair with liquid-liquid heat exchange to cool heat sources and reduce unnecessary service downtime.