Liquid Cooler Housing With Drain Guidance for PCB Short-Circuit Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling devices face issues with liquid coolant leakage and dew condensation leading to potential short circuits and migration in substrates, particularly in metal water-cooling units, where applying coatings for water and moisture resistance increases resistance values and disrupts conductive states in communication and ground lines.
Innovation Solution
A cooling device design that includes a liquid cooler with an inlet and outlet port housed in a guide member, utilizing a height adjustment mechanism to thermally couple with cooling target components, preventing short circuits and migration by guiding liquid coolant flow to maintain conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating for water resistance and moisture resistance is applied to the substrate, then the substrate is protected from short circuits and migration, but the resistance value increases and the conductive state is disrupted
Solution Approach 1:
The substrate surface is divided into different regions: a first region with higher water resistance for coolant leakage prevention, and a second region with lower water resistance for maintaining conductive state. This segmentation allows different functional requirements to be satisfied in different areas without compromising overall system performance.
Solution Approach 2:
Different regions of the substrate are given different water resistance properties tailored to their specific functional needs. The first region (coolant contact area) has high water resistance, while the second region (conductive line area) has low water resistance, optimizing both protection and conductivity locally.
2Reliability
If a coating for water resistance and moisture resistance is applied to the substrate, then the substrate is protected from short circuits and migration, but the conductive state of communication lines and ground lines is disrupted
Solution Approach 1:
The substrate surface is segmented into functional zones: a first region for coolant interaction with high water resistance, and a second region for electrical conduction with low water resistance. This ensures that protective properties are applied only where needed, preserving conductive pathways.
Solution Approach 2:
The water resistance property is localized to the first region that contacts the coolant, while the second region containing communication lines and ground lines maintains low water resistance to preserve its conductive state, preventing disruption to electrical signals.
3Temperature
If the gap between chip and heat dissipation member is closed, then thermal resistance is reduced and heat dissipation is improved, but the complexity of the cooling device increases
Solution Approach 1:
The cooling device includes a self-adjustment mechanism that automatically closes gaps between chips and heat dissipation members through thermal expansion or mechanical self-regulation, eliminating the need for complex external adjustment mechanisms while maintaining optimal thermal contact.
Solution Approach 2:
The system utilizes changes in physical parameters (such as thermal expansion coefficients or elastic properties) to automatically adjust the gap between components, allowing the cooling device to maintain optimal thermal contact without requiring complex control systems or adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents short circuits and migration in substrates even with coolant leakage or dew condensation, ensuring efficient heat dissipation and continuous operation of cooling target components.
Implementation Method 1
a liquid cooler that is thermally coupled to a plurality of cooling target components mounted on the substrate and that causes a liquid coolant to flow into a liquid coolant flow path
Implementation Method 2
The housing includes a guide member that guides a liquid to be removed in a predetermined direction
Data Source
AI summary
A cooling device according to an embodiment cools a plurality of cooling target components mounted on a substrate. The cooling device includes a liquid cooler, an inlet port, an outlet port, and a housing. The liquid cooler is thermally coupled to the plurality of cooling target components and causes a liquid coolant to flow into a liquid coolant flow path to cool the plurality of cooling target components. The inlet port introduces the liquid coolant into the liquid coolant flow path. The outlet port discharges the liquid coolant from the liquid coolant flow path. The housing houses the liquid cooler in a state in which the inlet port and the outlet port protrude. The housing includes a guide member that guides a liquid to be removed in a predetermined direction.