Triple Liquid Cooling Cycle for High-Power Chip Heat Dissipation
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Solution Overview
Problem
Conventional liquid cooling technologies for data center servers face limitations in cooling capacity, especially for high-performance chips, leading to increased energy consumption and environmental impact, and the use of harmful chemicals in immersion cooling poses health and safety risks.
Innovation Solution
An electronic device with a triple liquid cooling cycle that integrates two-phase flow circulation using a vapor chamber, cold plate cooling, and immersion-type cooling, effectively transferring heat from both primary and secondary sources through three-tiered liquid cooling cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cold plate liquid cooling technology is used, then cooling capacity is provided for chips, but cooling capacity reaches thermal dissipation limits when chip power exceeds 500W
Solution Approach 1:
The patent merges cold plate liquid cooling technology with immersion liquid cooling technology into a hybrid cooling system. The cold plate module handles localized high-heat-density areas while the immersion cooling liquid provides overall thermal management, creating a synergistic effect that exceeds the capabilities of either system alone.
Solution Approach 2:
The cooling system is designed to serve multiple functions: the cold plate module provides direct contact cooling for specific high-power chips, while the immersion cooling liquid simultaneously cools multiple heat-generating components across the circuit board, making the system adaptable to various thermal loads and configurations.
2Temperature
If air cooling with fans is used for electronic heat-generating components, then cooling is provided, but heat is released into the server room increasing temperature and requiring air conditioning
Solution Approach 1:
The patent introduces a non-conductive cooling liquid as an intermediary substance that directly absorbs heat from multiple heat-generating components through immersion. This mediator transfers thermal energy efficiently from the components to the cooling liquid, eliminating the need for air cooling and subsequent air conditioning systems.
Solution Approach 2:
The system utilizes hydraulic principles by circulating a liquid cooling medium through the server components. The cooling liquid flows through channels and immerses in heat-generating areas, using fluid dynamics to maximize heat transfer efficiency and continuously remove thermal energy from the system.
3Temperature
If two-phase immersion cooling technology using perfluorocarbons is used, then heat dissipation is achieved, but vaporized perfluorocarbons cause corrosion and contamination
Solution Approach 1:
The patent changes the chemical parameters of the cooling liquid by selecting non-conductive cooling liquids with different properties than traditional perfluorocarbons. These alternative liquids maintain the necessary thermal transfer characteristics while eliminating the harmful corrosion and contamination effects, achieving the same cooling function with safer materials.
4Temperature
If conventional cooling systems are used for high-performance chips exceeding 1000W, then cooling is provided, but Power Usage Effectiveness (PUE) value increases
Solution Approach 1:
The hybrid cooling system combines the efficiency of cold plate cooling for high-power chips with the comprehensive coverage of immersion cooling. This merged approach achieves superior thermal management for chips exceeding 1000W while minimizing the energy required for cooling operations, thereby reducing the PUE value.
Solution Approach 2:
The system leverages phase transition principles where the cooling liquid absorbs heat and undergoes thermal phase changes to efficiently transport thermal energy away from high-power chips. This phase transition mechanism enables high heat dissipation rates with minimal energy input, directly reducing PUE.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency, reduces Power Usage Effectiveness (PUE) values, and minimizes the use of harmful chemicals, providing a more sustainable and energy-efficient cooling solution for high-performance chips.
Implementation Method 1
the first cooling liquid in the vapor chamber forms a third flow channel with two-phase flow circulation
Implementation Method 2
the first vapor chamber is arranged inside the second sealed case and has a heat evaporation end and a condensation end
Implementation Method 3
the first vapor chamber is arranged inside the second sealed case and has a heat evaporation end and a condensation end
Implementation Method 4
the first heat exchange cavity, the first liquid inlet and the first liquid outlet form a first flow channel for circulating the first cooling liquid
Implementation Method 5
the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for circulating the second cooling liquid
Data Source
AI summary
An electronic device with triple liquid cooling cycle comprises a first sealed case, a circuit motherboard and a liquid cooling module. The first sealed case comprises a first heat exchange cavity, a first liquid inlet, a first liquid outlet, a second liquid inlet and a second liquid outlet. The circuit motherboard is arranged inside the first sealed case and electrically connected to a first heat source. The liquid cooling module is coupled to the first heat source and comprises a first vapor chamber and a second sealed case having a second heat exchange cavity, a third liquid inlet and a third liquid outlet. Wherein, the first heat exchange cavity, the first liquid inlet and the first liquid outlet form a first flow channel for circulating the first cooling liquid; the second heat exchange cavity, the second liquid inlet, the third liquid inlet, the second liquid outlet and the third liquid outlet form a second flow channel for circulating the second cooling liquid; the third cooling liquid inside the first vapor chamber forms a third flow channel with two-phase flow circulation.