Integrated Heat Transfer Member for Multi-Height Component Cooling
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Solution Overview
Problem
Existing cooling devices face challenges in efficiently dissipating heat from components with varying heights on a substrate, leading to increased manufacturing complexity and costs due to the need for multiple heat transfer members and soldering points.
Innovation Solution
A cooling device with a unified heat transfer member featuring height adjustment portions that adapt to the varying heights of components, coupled with a liquid cooler for efficient heat dissipation, reducing the number of components and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plate-shaped heat transfer members of different heights are used for each chip, then heat dissipation efficiency is improved by absorbing height differences, but the number of parts and soldering portions increases leading to increased manufacturing complexity and costs
Solution Approach 1:
The patent merges multiple separate plate-shaped heat transfer members into a single integrated heat transfer member that includes multiple height adjustment portions. This unified structure maintains the ability to absorb height differences between chips while reducing the total number of parts and soldering connections, thereby resolving the contradiction between heat dissipation efficiency and manufacturing complexity
Solution Approach 2:
The heat transfer member is designed with multi-functionality by incorporating multiple height adjustment portions of different heights within a single component. This allows one universal heat transfer member to serve multiple chips with varying heights, eliminating the need for separate customized members for each chip and reducing overall device complexity
2Reliability
If multiple plate-shaped heat transfer members are used to match chip heights, then thermal coupling is improved, but the number of soldering portions increases causing increased manufacturing processes and costs
Solution Approach 1:
By combining multiple heat transfer members into one integrated member with multiple height adjustment portions, the patent reduces the number of soldering operations required while maintaining effective thermal coupling to all chips. This single-member approach preserves thermal performance while significantly simplifying the manufacturing process
3Device complexity
If a unified heat transfer member is used, then the number of parts and manufacturing steps is reduced, but it may be difficult to adapt to varying chip heights
Solution Approach 1:
The unified heat transfer member incorporates local variations in the form of multiple height adjustment portions, each with a specific height tailored to match corresponding chips. This local differentiation within a unified structure enables adaptation to varying chip heights while maintaining overall structural simplicity and reducing the number of parts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains cooling efficiency while minimizing the number of heat transfer members and manufacturing steps, thus reducing costs and complexity.
Implementation Method 1
The liquid cooler is thermally coupled to the heat transfer member
Implementation Method 2
A liquid coolant is circulated though the liquid cooler
Data Source
AI summary
A cooling device according to an embodiment cools a plurality of cooling target components mounted on a substrate. The cooling device includes a heat transfer member, and a liquid cooler. The heat transfer member is configured as one member and has a plurality of height adjustment portions formed according to heights of the plurality of cooling target components and mounting positions of the plurality of cooling target components. The liquid cooler is thermally coupled to the heat transfer member. A liquid coolant is circulated though the liquid cooler.