Wavy-Fin Liquid Cooling Plate for Uniform Chip Heat Dissipation
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Solution Overview
Problem
Existing liquid-cooling coolers fail to effectively dissipate heat from high-speed chips in electric vehicle power modules, necessitating improved heat dissipation solutions.
Innovation Solution
A liquid-cooling heat dissipation plate with wavy fins, featuring varying fin pitches and wavelengths along the cooling-liquid flow direction, integrated with a heat dissipation plate body made of high thermal conductive materials like copper or aluminum alloys, to enhance heat removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional liquid-cooling coolers are used, then the cooling system is simple and easy to manufacture, but the heat dissipation capability is insufficient for high-speed chips
Solution Approach 1:
The patent applies curved wavy fin structures instead of traditional straight fins. The wavy fins create a sinusoidal pattern that increases the surface area and disrupts boundary layer formation, enhancing heat transfer efficiency while maintaining a relatively simple manufacturing process through stamping or extrusion techniques.
Solution Approach 2:
The patent implements variable fin pitch and variable wavelength designs where different sections of the heat dissipation plate have different fin densities and wave characteristics. This allows optimization of heat dissipation in high-heat-generation areas while reducing complexity in lower-heat areas, achieving localized performance enhancement.
2Stability of the object's composition
If uniform fin pitch is used, then the manufacturing process is simple, but the heat dissipation uniformity across different areas is poor
Solution Approach 1:
The patent employs variable fin pitch design where the spacing between adjacent fins varies across different heat dissipation areas. Specifically, the first heat dissipation area has a different fin pitch from the second heat dissipation area, allowing each region to be optimized for its specific thermal load and achieve more uniform overall heat dissipation.
Solution Approach 2:
The patent changes the geometric parameters of the fins, specifically the pitch and wavelength, across different areas to optimize heat dissipation. The variable parameters allow adaptation to different thermal conditions in various sections of the heat dissipation plate.
3Productivity
If constant fin wavelength is used, then the structure is simple to manufacture, but the cooling liquid flow velocity and heat transfer efficiency are insufficient
Solution Approach 1:
The patent uses wavy fins with sinusoidal curvature instead of straight fins. The curved geometry increases turbulence in the cooling liquid flow, disrupts thermal boundary layers, and enhances convective heat transfer efficiency compared to conventional straight fin designs.
Solution Approach 2:
The patent implements variable wavelength design where the wavelength of the wavy fins changes across different heat dissipation areas. This parameter variation optimizes the balance between flow resistance and heat transfer enhancement in different regions, improving overall heat transfer efficiency.
4Productivity
If high fin density is used throughout, then heat dissipation capability increases, but pressure drop of cooling liquid increases
Solution Approach 1:
The patent applies high fin density selectively in areas with higher thermal loads while using lower fin density in areas with lower thermal loads. This localized optimization achieves effective heat dissipation where needed while minimizing unnecessary flow resistance and pressure drop in other areas.
Solution Approach 2:
The patent varies the fin pitch parameter across different heat dissipation areas, creating a gradient from finer pitch in high-heat areas to coarser pitch in low-heat areas. This parameter variation balances heat dissipation effectiveness with acceptable pressure drop characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wavy fin design increases cooling liquid flow velocity, achieving uniform heat dissipation and reducing pressure drop, thereby effectively managing heat from high-speed chips in electric vehicle power modules.
Implementation Method 1
The wavy fins are formed on the second heat dissipation surface of the heat dissipation plate body, the heat dissipation plate body is divided to have a first heat dissipation area to an N-th heat dissipation area according to a cooling-liquid flowing direction
Implementation Method 2
The first heat dissipation surface is configured to be in contact with a plurality of chips, and the second heat dissipation surface is configured to be in contact with a cooling liquid
Data Source
AI summary
A liquid-cooling heat dissipation plate includes multiple wavy fins and a heat dissipation plate body having first and second heat dissipation surfaces that are opposite to each other. The first heat dissipation surface is configured to be in contact with multiple chips, and the second heat dissipation surface is configured to be in contact with a cooling liquid. The wavy fins are formed on the second heat dissipation surface. The heat dissipation plate body is divided to have multiple heat dissipation areas. Each heat dissipation area is divided into an upstream area, a midstream area, and a downstream area according to a cooling-liquid flowing direction. An upstream fin wavelength of the upstream area is greater than a midstream fin wavelength of the midstream area, and a downstream fin wavelength of the downstream area is greater than the midstream fin wavelength of the midstream area.