Immersion Cooling Chassis Layout for High Thermal Design Power
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Solution Overview
Problem
Traditional air cooling systems struggle to manage thermal management risks in high-performance systems due to increased thermal design power, necessitating more effective cooling methods, particularly in data centers and edge computing environments.
Innovation Solution
The use of immersion cooling systems, where electronic components are directly immersed in electrically insulative liquids, either in single-phase or two-phase processes, to directly draw away heat, utilizing dielectric liquids for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling systems are used, then device complexity is low, but thermal management effectiveness is insufficient for high-performance systems
Solution Approach 1:
The patent transitions from air cooling to liquid immersion cooling, using dielectric liquids to directly contact and cool electronic components. This hydraulic approach leverages the higher specific heat and thermal conductivity of liquids compared to air, achieving superior thermal management effectiveness while the modular tank design keeps system complexity manageable.
Solution Approach 2:
The patent changes the physical state and properties of the cooling medium from gas (air) to liquid (dielectric fluid). This parameter change enables direct immersion cooling where the liquid contacts components directly, dramatically improving heat transfer efficiency and thermal management capability for high-performance systems.
2Temperature
If liquid immersion cooling is implemented, then cooling efficiency is improved, but electrical safety requirements increase due to conductive risks
Solution Approach 1:
The patent employs dielectric liquids with high electrical resistivity (greater than 10^12 ohm-centimeters) to create an electrically inert cooling environment. These specialized fluids prevent electrical conduction and short circuits while maintaining excellent thermal transfer properties, thus improving cooling efficiency without compromising electrical safety.
Solution Approach 2:
The patent uses composite cooling systems combining dielectric liquids with specific thermal and electrical properties, along with specialized tank materials and coatings. This composite approach ensures both high cooling efficiency through superior thermal contact and enhanced electrical safety through materials with appropriate dielectric properties.
3Power
If high thermal design power is handled, then system performance is improved, but thermal management risks increase
Solution Approach 1:
The patent introduces dielectric liquids as an intermediary cooling medium between high-power electronic components and the thermal environment. This intermediary fluid absorbs excessive heat through direct contact, preventing thermal runaway and other thermal management risks while enabling the system to handle higher thermal design power levels.
Solution Approach 2:
The patent utilizes phase transition materials and two-phase cooling mechanisms where the cooling liquid can transition between liquid and vapor phases. This phase change process absorbs large amounts of latent heat, effectively managing thermal risks in high-power systems by providing a natural heat sink that responds to thermal loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Immersion cooling systems provide enhanced thermal management by leveraging the higher specific heat and latent heat of vaporization of liquids, improving cooling efficiency and allowing independent resource upgrades and utilization in data centers with disaggregated resources.
Implementation Method 1
liquid has inherent advantages of higher specific heat (when no boiling is involved)
Implementation Method 2
The use of liquids to cool electronic components is being explored for its benefits over more traditional air cooling systems
Implementation Method 3
higher latent heat of vaporization (when boiling is involved)
Implementation Method 4
higher latent heat of vaporization (when boiling is involved)
Data Source
AI summary
Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An immersion cooling chassis includes a first face, a second face opposite the first face, a third face disposed between the first face and the second face, the third face perpendicular to the first face, a fourth face disposed between the first face and the second face, the fourth face perpendicular to the first face and opposite the third face, and a first portion to be cooled via a first convection of a coolant fluid, the first portion including a coolant inlet defined in the third face, and a coolant outlet defined in the first face, and a second portion to be cooled via a second convection of air, the second portion including an air inlet defined in the first face between the fourth face and the coolant outlet.