Sealed Cooling Cartridge Architecture for Serviceable Liquid Cooling
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Solution Overview
Problem
Conventional liquid cooling systems for data centers face challenges such as cumbersome implementation, serviceability issues, high maintenance costs, lack of standardization, and vendor-specific solutions, which hinder scalability and widespread adoption.
Innovation Solution
A modular computing and cooling architecture featuring a hermetically sealed electronic cooling cartridge that includes both electronic and cooling components, allowing for easy insertion and removal from larger systems, with standardized dimensions and operational specifications, enabling service and replacement at the module level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid cooling systems are implemented in data centers, then cooling capability is provided, but serviceability deteriorates and maintenance costs increase
Solution Approach 1:
The cooling system is divided into modular cartridges that can be independently removed and replaced. Each cartridge contains integrated cooling components (cold plates, pumps, reservoirs) that are pre-assembled as discrete serviceable units, allowing maintenance personnel to replace individual cartridges without disassembling the entire cooling system.
Solution Approach 2:
The cooling function is extracted from the processor package and implemented as separate removable cartridges. This allows the cooling components to be independently serviced, replaced, or upgraded without affecting the processor or other system components.
2Temperature
If conventional liquid cooling systems are implemented, then thermal management is achieved, but device complexity increases
Solution Approach 1:
Multiple cooling functions (cold plates, pumps, reservoirs, tubing) are merged into single integrated cartridges. This consolidation reduces the number of discrete components and connections required in the overall system, simplifying installation and reducing complexity despite maintaining full thermal management capability.
Solution Approach 2:
The cartridges are designed with standardized interfaces that allow them to be used across different processor packages and system configurations. A single cartridge design can serve multiple cooling locations and be replaced with identical or upgraded cartridges, reducing the variety of components needed in the system.
3Ease of operation
If modular cartridges are used, then ease of operation improves through easy insertion and removal, but manufacturing precision requirements increase
Solution Approach 1:
The cartridges are pre-assembled and pre-tested as complete functional units before deployment. All internal components (cold plates, pumps, reservoirs, tubing) are installed and calibrated during cartridge manufacturing, ensuring proper fit and function. This preliminary preparation reduces the precision requirements during final installation, as the cartridge arrives ready-to-install with all internal adjustments already made.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces maintenance costs, enhances scalability, and facilitates standardized maintenance by allowing modular components to be swapped out easily, addressing the limitations of conventional liquid cooling systems.
Implementation Method 1
a first semiconductor die (104) mounted on the cartridge substrate (406)... one or more cooling units (430) for cooling the first semiconductor die (104)
Implementation Method 2
a fluid distribution unit (426) to distribute the cooling liquid into the one or more cooling units (430)... a fluid collection unit (428) to collect the cooling liquid from the one or more cooling units (430)
Data Source
AI summary
A modular computing and cooling system is described. For example, an apparatus may comprise a physical interface for a modular computing and cooling system and an electronic cooling cartridge for insertion into the physical interface and removal from the physical interface. The electronic cooling cartridge may comprise an internal electronic component, an internal cooling component for thermal management of the internal electronic component using a cooling fluid, a set of internal connectors to connect the internal electronic component and the internal cooling component to an external electronic component and an external cooling component, respectively, of the modular computing and cooling system, and a closed container encapsulating the internal electronic component, the internal cooling component, and the set of internal connectors. Other embodiments are described and claimed.