Integrated Liquid Cooling Module for Low-Leakage Heat Dissipation
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Solution Overview
Problem
Existing heat-dissipation assembly structures for electronic devices, particularly those used in inverters, are bulky, heavy, and prone to cooling fluid leakage, with significant thermal resistance between components.
Innovation Solution
A closed integrated heat-dissipation assembly structure that integrates a heat sink plate, power modules, an accelerator, and a flow channel plate through welding, forming a one-piece architecture with manifold chambers and parallel flow channels to reduce thermal resistance and fluid leakage risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple separate components (heat sink plate, waterproof gasket, flow channel plate) are assembled together, then the structure is easy to assemble, but the occupied volume and weight increase
Solution Approach 1:
The patent merges the heat sink plate, flow channel plate, and waterproof gasket into a single integrated heat dissipation assembly. The flow channel plate is directly formed on the heat sink plate, eliminating the need for separate waterproof gaskets and multiple assembly steps. This integration reduces the overall occupied volume while maintaining ease of manufacture through a unified structure.
2Ease of manufacture
If multiple separate components are assembled together, then the structure is easy to assemble, but the weight increases
Solution Approach 1:
The patent combines multiple separate components into a single integrated heat dissipation assembly, eliminating redundant materials such as separate waterproof gaskets and reducing the total weight. The unified structure achieves the same cooling function with less material, thereby reducing weight while maintaining ease of assembly through integrated design.
3Ease of manufacture
If separate components are assembled through O-RING, then the structure is easy to assemble, but the risk of cooling fluid leakage increases
Solution Approach 1:
The patent integrates the flow channel plate directly onto the heat sink plate, eliminating the need for O-RINGS or separate waterproof gaskets. This direct integration removes potential leakage points at the interfaces between separate components, significantly reducing the risk of cooling fluid leakage while maintaining ease of assembly through a unified structure.
Solution Approach 2:
The patent removes the waterproof gasket component entirely from the assembly, extracting the leakage risk associated with gasket seals. By directly forming the flow channel plate on the heat sink plate, the design eliminates the intermediate sealing layer, reducing leakage risk while simplifying the assembly structure.
4Ease of manufacture
If separate components are assembled, then the structure is easy to assemble, but thermal resistance between components increases
Solution Approach 1:
The patent merges the heat sink plate and flow channel plate into a single integrated structure, eliminating the thermal resistance that would exist at the interfaces between separate assembled components. The direct integration ensures continuous thermal pathways from the power modules through the heat sink to the cooling fluid channels, improving heat dissipation efficiency without compromising ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the system's volume and weight, minimizes thermal resistance, and enhances heat dissipation efficiency by evenly distributing cooling fluid flow to power modules, ensuring uniform heat dissipation across multiple modules.
Implementation Method 1
the heat sink plate, the accelerator and the flow channel plate are also assembled into one through welding, so that the columnar pin fins of the heat sink plate are combined to form the cooling flow channel
Implementation Method 2
the cooling fluid enters the heat exchange chamber from the inlet flow channel, then continuously flows through the heat dissipation fins of a plurality of heat sink plates for heat dissipation
Implementation Method 3
the power modules and the heat sink plate, the accelerator and the flow channel plate of the liquid cooling modules are assembled through the processes of, such as brazing welding, diffusion welding, friction stir welding, lightning welding, ultrasonic welding
Data Source
AI summary
A closed integrated heat-dissipation assembly and a liquid cooling module thereof are disclosed. The heat-dissipation assembly includes a heat sink plate, plural power modules, an accelerator, a flow channel plate, an inlet pipe and an outlet pipe. The heat sink plate includes a top surface, a bottom surface and plural pin fins arranged on the bottom surface. The power modules are directly disposed on the top surface of the heat sink plate. The accelerator is combined with the pin fins to form a cooling flow channel. The flow channel plate is closely assembled with the bottom surface of the heat sink plate. The flow channel plate includes an inlet and an outlet connected to an inflow chamber and an outflow chamber, respectively, and in communication with each other through the cooling flow channel. The inflow pipe and the outflow pipe are connected to the inlet and the outlet respectively.