Movable Fluid Flow Structure for Adaptive Electronics Cooling
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Solution Overview
Problem
Computing devices generate significant heat during operation, which can lead to component damage, and existing cooling systems struggle to efficiently manage thermal energy due to varying thermal demands from different applications.
Innovation Solution
A thermal management device with movable fluid movement structures, actuated by mechanisms like piezoelectric, shape memory, magnetic, or chemically reactive elements, enhances heat transfer by directing fluid flow and ejecting vapor bubbles, adapting to changing thermal conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling systems are used, then cooling function is provided, but thermal transfer efficiency is insufficient under varying thermal demands
Solution Approach 1:
The patent implements movable fluid movement structures that can dynamically adjust their position and configuration in response to varying thermal demands. The fluid movement structure includes movable elements that can change the flow path and distribution of cooling fluid, allowing the system to adapt to different thermal loads and maximize thermal transfer efficiency under varying operating conditions.
Solution Approach 2:
The system changes physical parameters of the cooling fluid flow by moving the fluid movement structure to different positions. This includes changing flow velocity, flow direction, and flow distribution patterns to optimize heat transfer coefficients and thermal management performance under different thermal conditions.
2Productivity
If fixed fluid flow direction is used, then system simplicity is maintained, but thermal management effectiveness under heterogeneous heat production is reduced
Solution Approach 1:
The fluid movement structure incorporates movable components that can dynamically redirect cooling fluid flow to different regions of the heat-generating component. This dynamic flow redirection capability allows the system to effectively manage heterogeneous heat production patterns without requiring an overly complex multi-zone cooling system.
Solution Approach 2:
The single fluid movement structure serves multiple functions: it can redirect flow to different regions, adjust flow distribution patterns, and adapt to various thermal load configurations. This multi-functionality allows effective thermal management of heterogeneous heat production using a unified rather than multiple separate systems.
3Productivity
If passive cooling is used, then device complexity is minimized, but cooling performance under heavy processing loads is insufficient
Solution Approach 1:
The system transitions from passive to active cooling by incorporating a movable fluid movement structure that can be actuated in response to thermal conditions. The movable structure actively redirects and optimizes cooling fluid flow under heavy processing loads, significantly enhancing cooling performance compared to purely passive cooling systems.
Solution Approach 2:
The system incorporates thermal sensing and feedback mechanisms that monitor temperature conditions and trigger the fluid movement structure to adjust its position and flow patterns. This feedback-driven active fluid flow management ensures optimal cooling performance is maintained under varying and heavy thermal loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device increases thermal transfer efficiency by actively or passively managing fluid flow, preventing dryout, and maintaining effective cooling even under heterogeneous heat production, thus protecting components from damage.
Implementation Method 1
actuated by mechanisms like piezoelectric, shape memory, magnetic, or chemically reactive elements
Implementation Method 2
actuated by mechanisms like piezoelectric, shape memory, magnetic, or chemically reactive elements
Implementation Method 3
actuated by mechanisms like piezoelectric, shape memory, magnetic, or chemically reactive elements
Implementation Method 4
the body is configured to receive heat from a heat-generating component at a proximal surface... and the body is configured to transfer heat to the working fluid
Implementation Method 5
the fluid movement structure is configured to direct fluid flow of a working fluid
Implementation Method 6
preventing dryout, and maintaining effective cooling
Data Source
AI summary
A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.