Flexible Membrane Coolant Container for Adaptive Electronics Cooling
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Solution Overview
Problem
Existing thermal management containers for electronic objects are rigid and inflexible, requiring separate designs for each size and configuration, leading to inefficiency and high manufacturing costs, as they cannot adapt to varying thermal management demands and sizes of electronic components.
Innovation Solution
A flexible membrane container with adjustable size, shape, and volume, featuring a first flexible membrane, inflow and outflow conduits, and optional support frames, allowing for customizable thermal management of electronic objects using dielectric coolants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid materials are used to construct thermal management containers, then structural strength and stability are improved, but adaptability to different electronic object sizes and configurations deteriorates
Solution Approach 1:
The patent applies flexible membrane materials to construct the container walls, replacing traditional rigid materials. This allows the container to be deformable and adaptable to different electronic object sizes and configurations while maintaining structural integrity through the membrane's inherent strength properties
Solution Approach 2:
The container is designed with dynamic, adjustable characteristics where the flexible membrane can be deformed and reconfigured. This enables the same container structure to adapt to various electronic object dimensions and shapes, transforming a static rigid structure into a dynamic adaptable system
2Loss of energy
If rigid containers are designed for specific electronic object sizes, then thermal management efficiency is improved, but manufacturing complexity and cost increase due to multiple container designs
Solution Approach 1:
The flexible membrane container is designed as a universal structure that can accommodate multiple types and sizes of electronic objects. Instead of creating separate rigid containers for each electronic object size, a single flexible container design can be adapted to serve multiple functions and configurations, reducing manufacturing complexity
3Adaptability or versatility
If rigid containers are made large enough to accommodate the largest electronic objects, then versatility is improved, but thermal management efficiency deteriorates due to excess volume
Solution Approach 1:
The flexible membrane container can dynamically adjust its volume and shape to match the actual electronic object placed inside. Rather than maintaining a fixed large size for potential future use, the container adapts to the current load, minimizing excess volume and improving thermal management efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient thermal management of electronic objects by adjusting to their specific size and shape, reducing excess volume, and facilitating heat exchange through flexible membranes and optional support frames, thereby optimizing thermal regulation and reducing manufacturing costs.
Implementation Method 1
The dielectric coolant is then either mechanically circulated (forced convection) or circulated through natural convection around or through the object in the container to thermally manage the electronic components
Implementation Method 2
The dielectric coolant is then either mechanically circulated (forced convection) or circulated through natural convection around or through the object in the container
Data Source
AI summary
A flexible membrane container for thermal management of an electronic object, the flexible membrane container comprising a first flexible membrane defining a bag-like container having a first interior volume, the container having an opening for removably receiving an electronic object. At least one outflow conduit is disposed in fluid communication with the first interior volume, and at least one inflow conduit is disposed in fluid communication with the first interior volume, thereby enabling a liquid dielectric coolant from a source external to the flexible membrane container to enter into the first interior volume. An insert frame member having a header is configured for releasably attaching to the electronic object. The header provides controls and power connectivity for electronic communication with the electronic object.