Cooled Pin Lifter Paddle Heat Shielding for Semiconductor Processing
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Solution Overview
Problem
Semiconductor substrate processing chambers face challenges in heat management, as cooling the bottom walls with flow passages increases chamber height, necessitating a solution to reduce height while effectively shielding heat from the pedestal to the chamber components.
Innovation Solution
A cooled pin lifter paddle with a heat shield and peripheral flow passages for coolant circulation is introduced, allowing vertical movement to lift substrates and shield heat from the pedestal, eliminating the need for bottom wall flow passages and reducing chamber height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling flow passages are installed in the bottom wall to shield heat, then heat shielding effect is improved, but chamber height increases
Solution Approach 1:
The cooling function is relocated from the bottom wall (horizontal dimension) to the pin lifter paddle (vertical dimension). The pin lifter paddle, which naturally moves vertically to perform substrate lifting, now incorporates cooling flow passages and acts as a mobile heat shield between the heated substrate and the bottom wall, achieving heat shielding without increasing chamber height.
Solution Approach 2:
The pin lifter paddle is given multiple functions: it performs substrate lifting (original function) and simultaneously serves as a mobile heat shield with integrated cooling passages (new function). This multi-functionality eliminates the need for separate bottom wall cooling structures, thereby avoiding height increase while maintaining effective heat management.
2Temperature
If bottom wall cooling structure is added to shield heat, then temperature control is improved, but device complexity increases
Solution Approach 1:
The pin lifter paddle integrates multiple functions including substrate lifting and heat shielding with cooling. By making the existing pin lifter paddle multi-functional rather than adding separate cooling structures to the bottom wall, the overall device complexity is avoided while temperature control capability is enhanced.
Solution Approach 2:
The pin lifter paddle serves itself by incorporating cooling flow passages within its own structure. The coolant circulation system cools the paddle itself, which then radiates less heat toward the bottom wall, creating a self-regulating heat management system without requiring complex external cooling infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration dynamically controls temperature, shields heat from chamber components, and reduces chamber height by allowing for efficient heat removal through coolant circulation, enhancing substrate processing efficiency.
Implementation Method 1
at least one flow passage in an outer peripheral portion thereof through which a coolant can be circulated to remove heat absorbed by the heat shield
Implementation Method 2
a coolant can be circulated to remove heat absorbed by the heat shield of the cooled pin lifter paddle
Data Source
AI summary
A semiconductor substrate processing apparatus includes a cooled pin lifter paddle for raising and lowering a semiconductor substrate. The semiconductor substrate processing apparatus comprises a processing chamber in which the semiconductor substrate is processed, a heated pedestal for supporting the semiconductor substrate in the processing chamber, and the cooled pin lifter paddle located below the pedestal. The cooled pin lifter paddle includes a heat shield and at least one flow passage in an outer peripheral portion thereof through which a coolant can be circulated to remove heat absorbed by the heat shield of the cooled pin lifter paddle. The cooled pin lifter paddle is vertically movable such that lift pins on an upper surface of the heat shield travel through corresponding holes in the pedestal and a source of coolant is in flow communication with the at least one flow passage.