Power Semiconductor Module Cooling Case with Flow Spacer
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Solution Overview
Problem
Conventional power semiconductor modules experience decreased cooling efficiency due to disturbed pressure distribution of the cooling liquid between the inlet and heat sink, and between the heat sink and outlet, which also leads to increased manufacturing costs and size issues, particularly in vehicle applications where downsizing is critical.
Innovation Solution
Incorporating a spacer between the inlet and outlet portions of the cooling case to optimize the pressure distribution of the cooling liquid, allowing it to flow smoothly between the heat sink and the base plate, while reducing the need for complex processing and minimizing the cooling case size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cooling case is molded by drawing with a side wall shape that makes the gap between the heat sink and the side wall small, then the cooling efficiency is improved, but the cooling case is enlarged and the number of processing steps is increased
Solution Approach 1:
The invention introduces a partition wall that divides the cooling case into a first cooling chamber and a second cooling chamber. This segmentation allows the cooling case to be formed by simple drawing without requiring complex side wall shapes, while still achieving effective cooling by directing cooling liquid through separate flow paths around the heat sink.
Solution Approach 2:
The partition wall acts as an intermediary structure that guides the cooling liquid flow. It creates defined flow paths that ensure the cooling liquid passes through the gaps between the heat sink and the cooling case walls, maintaining good thermal contact without requiring the cooling case to be enlarged or complexly shaped.
2Reliability
If the cooling case is molded by drawing with a side wall shape that makes the gap between the heat sink and the side wall small, then the cooling efficiency is improved, but the number of processing steps is increased
Solution Approach 1:
The partition wall divides the cooling case into separate chambers, allowing each to be formed by simple drawing processes. This segmentation avoids the need for complex single-piece molding or multiple assembly steps, as the partition can be easily integrated into the drawing process.
Solution Approach 2:
The invention changes the flow path configuration by introducing the partition wall, which allows the cooling liquid to flow through defined paths around the heat sink. This parameter change in flow distribution achieves good cooling efficiency without requiring complex geometric parameters of the cooling case itself.
3Ease of manufacture
If the cooling liquid flows directly from the inlet to the outlet through a gap between the heat sink and the side wall, then the pressure distribution is disturbed, but the manufacturing is simplified
Solution Approach 1:
The partition wall segments the cooling liquid flow into a first flow path and a second flow path. This segmentation ensures that the cooling liquid must flow around the heat sink through controlled paths, preventing direct short-circuiting through gaps and maintaining proper pressure distribution for effective cooling.
Solution Approach 2:
The partition wall serves as an intermediary that controls and directs the cooling liquid flow. It prevents the cooling liquid from taking unwanted shortcuts through gaps between the heat sink and side walls, ensuring that the pressure distribution remains optimal for heat transfer while keeping the manufacturing process simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by maintaining optimal pressure distribution and reduces manufacturing costs through simplified processing, aligning with the requirements for downsized and lightweight power semiconductor modules in vehicle applications.
Implementation Method 1
power semiconductor elements are cooled by the cooler. The cooler of the power semiconductor module includes a metal base plate that transfers generated heat of the power semiconductor elements
Implementation Method 2
a metal base plate that transfers generated heat of the power semiconductor elements
Data Source
AI summary
A power semiconductor module includes a laminate substrate; a semiconductor element joined to a front surface of the laminate substrate; a base plate 14 joined to a rear surface of the laminate substrate; a cooling case 15 which 15 has a heat sink 17, a bottom wall 15a, a side wall 15b formed around the bottom wall 15a, an inlet portion 15c and an outlet portion 15d for a cooling-liquid which are connected to either the bottom wall 15a or the side wall 15b, in which one end of the side wall 15b is joined to a rear surface of the base plate 14 such that a cooling liquid can flow into a space surrounded by the base plate 14, the bottom wall 15a, and the side wall 15b. The power semiconductor module further includes a spacer 20 between the inlet portion 15c and the outlet portion 15d.