Power Semiconductor Module Cooling Case Inlet Outlet Flanges

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Solution Overview

Problem

Existing power semiconductor modules face challenges in facilitating the connection to inlet and outlet openings of the cooling body, leading to cumbersome mounting operations, especially in limited spaces such as hybrid or electric vehicles, due to the need for separate operations and labor-intensive pipe attachment.

Innovation Solution

The power semiconductor module design incorporates a cooling case with flanges at the inlet and outlet openings, allowing direct connection to a flow path member without the use of pipes, reducing labor and space requirements by integrating the connection points on the bottom surface of the cooling case.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external pipes are attached to the inlet opening and outlet opening of the cooling case, then the cooling function is achieved, but the mounting operation becomes complex and labor-intensive

Engineering Contradiction:

Improvecooling functionVSAvoidmounting operation

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent merges the cooling case with the flow path member by directly forming the flow paths within the cooling case structure. The inlet passage and outlet passage are integrated into the cooling case body, eliminating the need for separate external pipe attachments. This combining of functions reduces mounting complexity while maintaining the cooling capability.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If the inlet passage and outlet passage are provided on the side surface of the plastic base, then connection to additional cooling members is facilitated, but the module becomes bulky

Engineering Contradiction:

Improveconnection to additional cooling membersVSAvoidmodule size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent relocates the inlet passage and outlet passage from the side surface to the bottom surface of the cooling case. This dimensional change allows the passages to be positioned in a more space-efficient location, reducing the overall module volume while still providing accessible connection points for additional cooling members through the bottom surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If separate operations for mounting the power semiconductor module and attaching external pipes are required, then the cooling system can be assembled, but the labor and time required increase significantly

Engineering Contradiction:

Improvecooling system assemblyVSAvoidlabor and time required

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent combines the mounting of the power semiconductor module with the integration of the flow path in a single operation. By forming the inlet and outlet passages directly within the cooling case structure, the module mounting process simultaneously completes the fluid path configuration, eliminating the need for separate pipe attachment operations and significantly reducing assembly time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The flow paths are pre-formed within the cooling case structure during the cooling case manufacturing process, before the actual module assembly takes place. This preliminary preparation of the fluid passages ensures that when the power semiconductor module is mounted, the cooling function is already integrated and ready to operate, eliminating subsequent pipe attachment steps.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the mounting process, reduces the number of bolts needed, and enhances the rigidity of the module, while preventing leakage and minimizing the module's size and weight, thus improving cooling efficiency and reliability.

Implementation Method 1

a cooling case (13) joined to the rear surface of the metal base plate (12), allowing a coolant to be circulated in a space enclosed by the metal base plate (12), the bottom surface (13a), and the side surface (13b)

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

a metal base plate (12) having a front surface and a rear surface; a multi-layer substrate (15) joined to the front surface of the metal base plate (12)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10192807B2Power semiconductor module, flow path member, and power-semiconductor-module structure

Publication Date: 2019.01.29 FUJI ELECTRIC CO LTD

AI summary

The invention is provided with a metal base plate including a first surface and a second surface and a cooling case including a bottom wall and a side wall formed around the bottom wall, in which one end of the side wall being joined to a second surface side of the metal base plate, and a coolant can be circulated in a space enclosed by the metal base plate, the bottom wall, and the side wall, in which the cooling case has an inlet portion and an outlet portion for the coolant which are connected to either the bottom wall or the side wall and disposed along a peripheral edge of the second surface of the metal base plate, and includes a first flange disposed at an inlet opening side of the inlet portion and a second flange disposed at an outlet opening side of the outlet portion.