Cooling Channel Turbulator Layout to Block Bypass Flow

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing cooling devices for electrical and electronic assemblies, such as power modules in hybrid and electric vehicles, face inefficiencies in heat dissipation due to bypass flows that reduce the effectiveness of heat transfer from the cooling fluid to the assemblies.

Innovation Solution

A cooling device with a turbulator design featuring a turbulence portion and blocking regions within the cooling channel to direct the cooling fluid flow through the turbulence portion and prevent bypass flows, utilizing a metal sheet bent to form the turbulator with integrated turbulence and blocking features.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional cooling channels are used without turbulators, then the device structure is simple, but heat dissipation efficiency is reduced due to bypass flows

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcooling device structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The cooling channel is segmented by dividing it into a first cooling channel and a second cooling channel, with the first channel positioned above the electronic assembly and the second below. This segmentation allows optimized flow paths in each region, improving heat dissipation efficiency while maintaining structural simplicity through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the cooling device are assigned different functions: the first cooling channel region is optimized for direct cooling of the electronic assembly, while the second cooling channel region handles bypass flow management. This local differentiation improves overall heat dissipation efficiency without requiring complete redesign of the entire cooling system.

Inventive Principle:
Principle #3Local quality

2Loss of energy

If bypass regions are allowed in cooling channels, then fluid flow path is simple, but cooling effectiveness is reduced due to flow bypassing the turbulence portion

Engineering Contradiction:
Improvecooling effectivenessVSAvoidflow control structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The cooling channel is divided into distinct segments: a first cooling channel above the electronic assembly and a second cooling channel below it. The separation means define clear boundaries between these segments, preventing bypass flows from mixing and ensuring each segment performs its specific cooling function effectively.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Separation means are introduced as intermediary elements between the first and second cooling channels. These separation means prevent direct communication between the channels, blocking bypass flows and ensuring that cooling fluid follows the intended path through both channels sequentially, thereby improving cooling effectiveness.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat dissipation efficiency by ensuring the cooling fluid flows through the turbulence portion, minimizing bypass losses, and effectively cooling the electrical and electronic assemblies.

Implementation Method 1

A turbulence portion for generating local turbulence in the flow of the cooling fluid

Methodology Applied
Scientific EffectTurbulence: Turbulence

Implementation Method 2

the blocking region of the turbulator blocks the flow adjacent to the turbulence portion, so that the cooling fluid cannot flow past the turbulator in said region

Methodology Applied
Scientific EffectFlow blocking:

Implementation Method 3

the electronic unit is thermally connected to the cooling device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250331139A1Cooling device for cooling an electrical and/or electronic assembly
Publication Date: 2025.10.23 ROBERT BOSCH GMBH
  • US20250331139A1 patent drawing
  • US20250331139A1 patent drawing
  • US20250331139A1 patent drawing

AI summary

The invention relates to a cooling device for cooling an electrical and/or electronic assembly (2), said cooling device comprising: a top plate (3) and a bottom plate (4), the bottom plate (4) being a deep-drawn component having a depression (40), the top plate (3) and the bottom plate (4) being arranged such that, due to the depression (40) a cooling channel (5) is formed between the top plate (3) and the bottom plate (4), the top plate (3) and the bottom plate (4) being connected to one another at a contact region (8) outside the depression (40), it being possible for a cooling fluid flow of a cooling fluid to flow through the cooling channel (5) along the longitudinal direction (11), the cooling device (1) also comprising at least one turbulator (6) that is arranged inside a turbulator section (56) of the cooling channel (5). According to the invention, a turbulence portion (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are formed on the turbulator (6).