See how a throttle portion with reduced cross-section increases flow velocity through the heat
See how a ceramic emission boosting layer enhances IR selectivity within 8-13 μm to improve day
Multiple heat-transfer fluid flow paths and counter-flow zones shape substrate temperature profiles and reduce max-min temperature differences.
Blocking regions and local turbulence redirect coolant through the active channel section, reducing bypass flow and improving heat dissipation.
Alternating 180° plate stacks with unequal turbulising elements boost heat transfer at high pressure while cutting heat exchanger size and weight.
Machined plates with interlocking ribs and diffusion bonding replace casting to create thinner, lighter heat exchangers with precise flow passages.
Machined plates with interlocking ribs replace slow cast structures, enabling thin bonded heat exchanger cores with lower weight and faster production.
Electrostatic pad deflection switches heat flow in MEMS thermal control, enabling passive cooling while preserving heating efficiency.
A layered non-cylindrical TPG tube directs heat along chosen paths, raising transport capacity while limiting unwanted heat transfer.
A movable inlet manifold element adjusts active channels by inflow momentum to reduce low-flow maldistribution and improve heat transfer.
A near-wall static auger boosts pipe turbulence and heat transfer, reducing heater complexity, cost, and maintenance burden.
See how closed-pore ceramic grading balances radiative cooling, mechanical strength, and protection from dust and pollutants.
Upward and downward impressions on alternating plates enhance oil-cooler heat exchange while keeping pressure drop low.
Encapsulated tungsten-doped vanadium dioxide switches thermal emittance with ambient temperature, limiting nighttime heat loss after daytime radiative cooling.
This AIO reservoir uses segmented flow paths to preserve coolant volume, reduce turbulence, and limit closed-loop pressure excursions.
A flow velocity control unit adjusts refrigerant speed to maintain non-boiling or nucleate boiling states in semiconductor cooling devices.
Radial fins on a central core conduct heat from exhaust gases to the fluid, resolving insufficient transmission in conventional pipes.
Oblique turbulence ridges connect parallel support valleys to prevent intermittent flow restrictions when plates rotate.
Selective surface texturing on spacer elements and plates resolves manufacturing complexity while improving heat transfer efficiency and mechanical strength.
Concave edge faces redirect fluid flow through tortuous paths, eliminating occlusion and starvation caused by conventional mitre joints.
Zigzag flow channels overlap in stacked bonding plates to increase heat transfer length within a compact printed circuit heat exchanger structure.
Free particles define narrow corner gaps to facilitate bubble nucleation, resolving repeatability issues from surface roughening.
Merging cover members with the holder reduces component count while suppressing temperature increases in optical isolators.
Staggered elongated protrusions resolve the strength versus efficiency trade-off by optimizing stress distribution while maintaining high heat exchange rates.
A heat sink uses dimples and openings to dissipate thermal energy via compressed air flow.
A streamlined wavy fin uses convex and concave ripples aligned with airflow streamlines to guide fluid flow smoothly along the heat transfer surface.
A graphite plate with through-holes and a three-metal coating system enhances heat conduction across the material.
A heat exchanger plate uses a homothetic distribution means to optimize fluid flow across circulation channels.
V-shaped protruding portions on heat exchanger plates generate longitudinal vortices in cooling water flow paths.
Vibrating hydrophobic surfaces sheds condensate drops at resonant frequency, overcoming capillary forces that limit heat transfer efficiency.
Parallel inclined bridges in a plate heat exchanger turbulence generator enhance mixing and heat transfer while minimizing pressure drops.
Tapering valleys in local part areas reduce flow resistance around closed portholes while maintaining effective heat transfer.
An active vortex generator oscillates within a fluid channel to manage bubble insulation and prevent temperature stratification during two-phase processes.
Symmetric wavy channels in stacked plates improve heat transfer while minimizing fouling and pressure drops caused by traditional fin structures.
Swirl tube channels lengthen flow paths and use centrifugal force to separate liquid droplets, resolving incomplete evaporation in plate heat exchangers.
Active flow disruption members induce unsteadiness in heat exchanger channels to increase thermal energy transfer.
Topology optimization of a 3D woven lattice resolves the trade-off between mechanical stiffness and heat transfer performance.
A rack-level liquid cooling plenum transfers thermal energy from blade servers via heat exchangers without direct fluid contact.
Merging air and fuel cooling paths reduces thermal stress on aircraft oil while preventing fuel degradation through dynamic flow distribution.
A heat sink uses internal ventilation paths between top wall parts to enable airflow and dissipate heat without external fins.
Serpentine tubes formed by protrusions with ridges and valleys increase the effective heat transfer area, resolving low efficiency from linear fluid flow.
A liquid cooling block coordinates with nanobubble fluid to disrupt thermal boundary layers and enhance heat exchange.
A passive thermal diode uses a shape memory alloy spring to displace a lever and control heat transfer between source and sink.
Protruding carbon nanostructures anchor in a metal matrix to enlarge the contact area, enabling reusability of thermal interfaces.
Curved corrugations on a heat exchanger plate gradually change inclination to improve fluid distribution while reducing flow resistance.
Segmented latch members connect around the cooling unit to prevent tube interference, enabling flexible pipeline routing and reducing manufacturing costs.
An internal fan pushes air through a base and cover channel to dissipate heat from electronic devices.
Undercut secondary grooves between helical ribs create local cavities that enhance bubble formation and resolve tool wear trade-offs.
Adjustable transitional curved surfaces modify minimum flow cross sections to decouple pressure drop control from fixed dimple geometry.
Wings segment channels between monolithic fins to shed condensate and reduce interface resistance.