Substrate Support Flow Path Layout for Thermal Uniformity
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Solution Overview
Problem
Conventional substrate processing methods often result in undesirable temperature profiles, leading to suboptimal process results due to inadequate thermal uniformity.
Innovation Solution
The apparatus includes a substrate support with multiple flow paths for a heat transfer fluid, featuring counter-flow configurations and multiple zones to enhance thermal uniformity and control temperature profiles across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling channels are used in substrate support, then cooling function is provided, but temperature uniformity across the substrate deteriorates
Solution Approach 1:
The cooling system is divided into multiple flow paths (first flow path and second flow path) with different fluid conductances. This segmentation allows different regions of the substrate to receive customized cooling rates, achieving uniform temperature distribution across the substrate while maintaining process quality.
Solution Approach 2:
Different flow paths are designed with different fluid conductances to provide localized cooling characteristics. The first flow path has a greater fluid conductance than the second flow path, enabling different cooling rates in different regions of the substrate support, which directly addresses the temperature uniformity issue.
2Temperature
If single flow path configuration is used, then device complexity is reduced, but temperature control precision deteriorates
Solution Approach 1:
The substrate support is divided into multiple zones with separate flow paths. Each flow path can be independently configured with specific fluid conductance values, enabling precise temperature profile control across different regions of the substrate while managing the complexity through modular design.
Solution Approach 2:
The fluid conductance parameter is varied across different flow paths to achieve the desired temperature profile. By changing the fluid conductance parameter (greater for first flow path, lesser for second flow path), precise temperature control is achieved without requiring complex active control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves more uniform temperature distribution and reduces the temperature difference between maximum and minimum temperatures, improving process consistency and efficiency.
Implementation Method 1
a plurality of flow paths having a substantially equivalent fluid conductance disposed within the substrate support to flow a heat transfer fluid beneath the support surface
Implementation Method 2
the first portion provides a flow of heat transfer fluid in a direction opposite a flow of heat transfer fluid of the second portion
Data Source
AI summary
Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.