Cooling Component Layout With Adjacent Supply and Discharge Ports
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Solution Overview
Problem
Existing cooling components fail to uniformly cool electronic components due to temperature variations in the refrigerant, leading to non-uniform cooling across the cooling target object.
Innovation Solution
A cooling component design featuring a heat receiving plate, multiple heat dissipating plates, and a refrigerant passing member with alternating supply and discharge ports that allow refrigerant to flow through adjacent through-holes, ensuring uniform distribution and absorption of heat across the cooling target.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the liquid refrigerant flows through the flow paths from supply ports to discharge ports, then the refrigerant receives heat from the electronic component, but the temperature of the liquid refrigerant increases as it passes through the flow paths, resulting in non-uniform cooling
Solution Approach 1:
The flow path is divided into multiple segments by providing both supply ports and discharge ports at each end of the flow path. This segmentation allows the refrigerant to be supplied at multiple locations and discharged at multiple locations, creating multiple smaller flow segments instead of one long flow path. As a result, the temperature difference of the refrigerant across the flow path is reduced, achieving more uniform cooling of the electronic component.
2Device complexity
If the refrigerant is supplied to the flow path at a single location, then the flow path structure is simple, but the refrigerant temperature increases along the flow direction, causing uneven cooling distribution
Solution Approach 1:
The flow path is divided into multiple segments by providing both supply ports and discharge ports at each end of the flow path. This segmentation allows the refrigerant to be supplied at multiple locations and discharged at multiple locations, creating multiple smaller flow segments instead of one long flow path. As a result, the temperature difference of the refrigerant across the flow path is reduced, achieving more uniform cooling of the electronic component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves substantially uniform cooling of the cooling target object by preventing refrigerant concentration on specific areas, thereby maintaining consistent temperature distribution.
Implementation Method 1
the liquid refrigerant receives heat from an electronic component as the liquid refrigerant passes through the flow paths
Data Source
AI summary
A cooling component includes a heat receiving plate that receives heat from the cooling target object; a plurality of heat dissipating plates disposed at predetermined intervals on the heat receiving plate; a refrigerant supplying path for supplying a refrigerant to the plurality of heat dissipating plates; a refrigerant discharging path to which the refrigerant is supplied from the plurality of heat dissipating plates; and a refrigerant passing member in which a plurality of through-holes through which the refrigerant passes are formed, wherein the refrigerant supplied by the refrigerant supplying path passes through some of the through-holes, while the refrigerant that passes through the remainder of the plurality of through-holes is discharged by the refrigerant discharging path, and some of the plurality of through-holes and the remainder of the plurality of through-holes are adjacent to each other.