Two-Phase Cooling Device Housing for Ice Formation Control
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Solution Overview
Problem
Two-phase cooling devices for electronic components face reliability issues due to bulging and leakage caused by improper freezing dynamics of the cooling medium, leading to loss of thermal contact and cooling performance when overfilled with water, which freezes and expands.
Innovation Solution
The two-phase cooling device is designed with a housing structure where the lower part of the bottom region is formed such that the last part of the cooling medium to freeze is the upper surface, preventing the formation of enclosed liquid pockets and subsequent pressure buildup, using features like zigzag shapes and crystallization surfaces to control ice formation and maintain thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cooling medium is overfilled in the cavity, then the cooling performance is improved, but the housing bulges and leaks when the cooling medium freezes
Solution Approach 1:
The patent applies preliminary action by designing the bottom region with a lower part and upper part structure before freezing occurs. This pre-configured structure ensures that when the cooling medium freezes and expands, the ice formation progresses from the lower part upward, preventing enclosed liquid pockets and subsequent bulging. The design anticipates the freezing process and prepares the geometry to accommodate expansion safely.
Solution Approach 2:
The patent changes the geometric parameters of the bottom region by dividing it into a lower part and an upper part with specific volume ratios. This parameter modification alters the freezing dynamics, ensuring that the ice front moves upward rather than forming enclosed pockets. The volume ratio parameter (lower part volume vs. upper part volume) is optimized to prevent bulging while maintaining cooling performance.
2Stress or pressure
If the cooling medium freezes completely enclosed, then high pressure builds up, but the housing structure is damaged
Solution Approach 1:
The patent prevents pressure buildup by preliminarily designing the bottom region geometry to allow controlled ice formation. The lower part and upper part structure ensures that freezing progresses upward, maintaining an open pathway for liquid cooling medium and preventing enclosed high-pressure pockets before they can form and damage the housing.
Solution Approach 2:
The patent applies local quality by creating different geometric characteristics in different regions of the bottom region. The lower part has a larger volume to accommodate initial ice formation and liquid cooling medium, while the upper part has a smaller volume. This local differentiation ensures that pressure is distributed and managed locally rather than building up uniformly, preventing housing damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable and efficient cooling of electronic components by preventing bulging and leakage, even when overfilled, by ensuring the last part of the cooling medium freezes as the upper surface, thus maintaining thermal contact and performance at temperatures below 0°C.
Implementation Method 1
A cooling medium (32) is in the cavity (24) for cooling the electronic component by a phase transition from a liquid state to a gaseous state
Implementation Method 2
at least the lower part (48) of the bottom region (30) of the housing (22) is formed such that, if the cooling medium (32) freezes, the last part of the cooling medium (32) to freeze is an upper surface (38) of the cooling medium (32)
Data Source
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AI summary
A two-phase cooling device (20) for cooling an electronic component is provided. The two-phase cooling device (20) comprises: a housing (22) surrounding a cavity (24), which has a top region (28) and a bottom region (30), with the bottom region (30) having a lower part (48) and an upper part (46); and a cooling medium (32) within the cavity (24) for cooling the electronic component by a phase transition from a liquid state to a gaseous state, wherein, when the cooling medium (32) is solely in the liquid state, the bottom region (30) is completely filled with the cooling medium (32) and the top region (28) is free from the cooling medium (32); wherein at least the lower part (48) of the bottom region (30) of the housing (22) is formed such that, if the cooling medium (32) freezes, the last part of the cooling medium (32) to freeze is an upper surface (38) of the cooling medium (32).