Cooling Liquid Flow Control Device with Temperature-Actuated Valve
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Solution Overview
Problem
Conventional water-cooling modules for electronic components lack the ability to control the flow rate of cooling liquid, which limits their effectiveness in optimizing heat dissipation across varying load states, such as idle or full load conditions.
Innovation Solution
A cooling liquid flow control device comprising a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element with a valve that adjusts the flow rate of cooling liquid based on the temperature of the heating element, utilizing a processing unit to actuate the valve and control the flow through aligned or non-aligned through holes and openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional water-cooling module is used without flow control, then the structure is simple, but the heat dissipation cannot be optimized in idle or full load states
Solution Approach 1:
The patent applies a dynamically adjustable valve mechanism that can rotate to different positions based on temperature feedback, allowing the cooling system to adapt its flow rate to varying thermal loads. This transforms a static cooling system into a dynamic one that responds to changing conditions, resolving the contradiction between simplicity and adaptability.
Solution Approach 2:
The temperature control element receives temperature signals from the heating element and uses this feedback to automatically adjust the valve position. This closed-loop feedback mechanism enables the system to optimize heat dissipation based on actual thermal conditions without requiring complex manual control, balancing adaptability with operational simplicity.
2Productivity
If the valve rotates to align through holes for maximum flow, then cooling efficiency increases under full load, but energy is wasted under idle conditions
Solution Approach 1:
The valve dynamically adjusts its rotation angle based on real-time temperature conditions, aligning through holes to maximize flow when cooling is needed (full load) and reducing flow when cooling demand is low (idle). This dynamic adjustment eliminates continuous energy waste while maintaining cooling efficiency when required.
Solution Approach 2:
The system changes the flow rate parameter by rotating the valve to different positions, thereby adapting the cooling intensity to match the thermal load. This parameter adjustment allows the system to optimize cooling efficiency during high-demand periods while minimizing energy consumption during low-demand periods.
3Ease of operation
If a temperature-controlled valve mechanism is added, then flow rate can be adjusted according to temperature, but the device complexity increases
Solution Approach 1:
The temperature control element automatically senses temperature changes and actuates the valve without external intervention. This self-service capability provides automatic flow control based on thermal conditions, eliminating the need for manual operation while keeping the control mechanism relatively simple and integrated into the existing cooling module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables proportional control of cooling liquid flow rate according to the heating element's temperature, optimizing heat dissipation and achieving energy savings by adjusting flow rates based on operational states.
Implementation Method 1
The bottom surface is configured to be in contact with a heating element on a substrate... The cavity is configured to circulate a cooling liquid
Implementation Method 2
The cavity is configured to circulate a cooling liquid... optimizing heat dissipation
Data Source
AI summary
A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to rotate based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.