Cooling/Ventilation/Heating Modifications TRIZ Cases

A cooling fan control unit adjusts rotation speed using intake air temperature and humidity sensor data.

Removable liquid cooling device with dual pumps circulates fluid to dissipate heat from high-performance server components.

Segmented server cooling zones use electromagnetic disconnection to isolate leaks, increasing return flow to remove residual fluid from electronics.

A hybrid liquid cooling system merges direct cold plate contact with immersion fluid to manage heat in electronic assemblies.

Barometers measure atmospheric pressure differences between internal and external device surfaces to detect fan faults or duct blockages that cause overheating.

An intermediary flow enhancement structure channels liquid coolant toward heat sink fins, resolving stagnation caused by circuit board arrangements.

A vehicle controller integrates cockpit and driving daughter boards on a shared motherboard to simplify hardware architecture.

Segmented air ducts with asymmetric cross-sections accelerate airflow through optical transceivers, reducing operating temperatures by 5 to 10 degrees Celsius.

A self-contained liquid cooling enablement module connects to processor cold plates via standardized interconnects.

Strategic vent orientation and a baffle define airflow gaps that dissipate heat from circuit boards without active cooling systems.

A heat dissipation layer with rounded-corner silicon carbide particles conducts thermal energy away from chip units in electronic devices.

A heat dissipation module uses etched substrate grooves and bonded second substrates to form sealed chambers filled with working fluid.

A heat-dissipation member with flowing coolant overlaps electronic parts through a housing hole to enhance thermal transfer.

An electromechanical assembly monitors motor voltage to lock a movable element and prevent component removal during operation.

A cooling system uses mineral oil coolant with specific aniline point to circulate through nitrile rubber channels in electrified vehicles.

Centralized coolant units balance fluid levels across separate immersion systems, reducing servicing complexity.

A two-stage compressor and variable speed fan adjust cooling capacity through loaded and unloaded state switching.

Configurable louvers on air handling unit canopies divert noise back toward the facility while preventing precipitation entry into sensitive components.

A cooling liquid flow control device uses a temperature-actuated valve to adjust fluid circulation rates within a heat dissipation cavity.

Segmented condenser arrays overcome high viscosity impedance in immersion cooling systems to boost heat transfer rates.

Vapor return units condense coolant gas to reduce fluid loss and improve thermal efficiency in two-phase cooling systems.

Direct liquid spraying on server components lowers junction temperatures, addressing high local heat in dense data centers.

Segmented cold plates with internal fins circulate coolant to remove processor heat through conduction and convection.

A negative relative pressure cooling system moves liquid through passageways using a vacuum.

A radial fan air conditioner uses a discharge grille to direct cooled air in a radial direction.

Telescoping duct sections and a drive mechanism adjust length to match device intake positions, resolving warm air recirculation issues.

Dual circulation immersion heat dissipation system uses independent liquid and gas loops to transfer thermal energy efficiently.

Segmented baffles divert rising vapor bubbles, preventing dielectric liquid displacement and ensuring consistent cooling for high heat flux devices.

A climate control system uses movable partitions to divide an electronic equipment room into independently cooled subchambers.

A modular data center cooling system exchanges heat between two-phase immersion vapor and air cooling streams using a dedicated gas-to-gas heat exchanger.

A liquid cooling apparatus uses a dynamic sealing mechanism to secure the cover plate against vibration.