Electronic Device Heat Dissipation via Composite Metal-Plastic Housing
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Solution Overview
Problem
Existing electronic devices in vehicles face challenges in efficiently dissipating heat while maintaining a lightweight design.
Innovation Solution
The electronic device incorporates a housing with a heat-dissipation passage and a metal heat-dissipation member through which coolant flows, allowing for direct contact with electronic parts via a heat-dissipation plate, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat-dissipation member is used to improve heat dissipation efficiency, then heat dissipation performance is improved, but weight increases
Solution Approach 1:
The patent applies composite materials by integrating a metal heat-dissipation member (first material) with a housing (second material different from the first). This allows the metal component to provide superior heat dissipation performance while the plastic housing maintains overall lightweight characteristics, resolving the contradiction between heat dissipation efficiency and weight.
2Weight of moving object
If a metal heat-dissipation member is integrated with plastic housing to reduce weight, then weight is reduced and manufacturing cost is lowered, but heat dissipation efficiency may be compromised
Solution Approach 1:
The patent uses composite materials by combining metal heat-dissipation components with plastic housing. The metal portions provide high thermal conductivity where needed, while the plastic provides lightweight structure, achieving both weight reduction and maintained heat dissipation efficiency.
Solution Approach 2:
The patent applies local quality by strategically placing metal heat-dissipation members in specific locations where heat generation occurs (such as near electronic components). This localized use of high-conductivity material optimizes heat dissipation efficiency only where required, while maintaining overall device lightweight characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency and reduces the weight of the electronic device by integrating a metal heat-dissipation member with a plastic housing, while also lowering manufacturing costs.
Implementation Method 1
a heat-dissipation member which is disposed in the heat-dissipation passage and in which coolant flows
Implementation Method 2
coolant flows
Implementation Method 3
the heat-dissipation member is disposed so as to at least partially overlap the electronic part in the up/down direction through the hole
Data Source
Figure 1
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AI summary
This electronic device comprises: a housing having a space therein and including a heat-dissipation passage penetrating from one side to another side; an electronic part disposed in the space; and a heat-dissipation member which is disposed in the heat-dissipation passage and in which coolant flows, wherein the heat-dissipation passage includes a hole facing the electronic part, and the heat-dissipation member is disposed so as to at least partially overlap the electronic part in the up/down direction through the hole.