Heat Dissipation Module With Etched Groove Chambers
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Solution Overview
Problem
Existing heat dissipation modules and electronic devices face challenges in optimizing space utilization and heat dissipation efficiency simultaneously, particularly in limited spaces.
Innovation Solution
A heat dissipation module manufacturing method involving a first substrate with etched grooves, bonded with second substrates to form chambers filled with a working fluid, enhancing heat transfer area and efficiency while accommodating electronic modules in a thinner design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional heat dissipation structures are used, then the device structure is simple, but the heat dissipation efficiency is insufficient and space utilization rate is low
Solution Approach 1:
The first substrate is divided into multiple functional regions including a first heat dissipation region with first chambers, a second heat dissipation region with second chambers, and a liquid crystal display region. This segmentation allows each region to be optimized for its specific function, improving overall heat dissipation efficiency while maintaining manufacturing simplicity through modular design
Solution Approach 2:
Multiple chambers are formed within the substrate structure, with chambers nested within the substrate thickness. The first chambers and second chambers are positioned at different depths and locations, creating a nested three-dimensional heat dissipation structure that increases heat transfer area without increasing the overall device footprint
2Length of moving object
If the device thickness is reduced, then the electronic device becomes thinner, but the space utilization rate and heat dissipation efficiency deteriorate
Solution Approach 1:
The heat dissipation structure transitions from two-dimensional surface cooling to three-dimensional volumetric cooling by forming multiple chambers at different depths within the substrate. This dimensional transformation allows efficient heat dissipation within a thinner profile by utilizing the third dimension (depth) for heat transfer pathways
Solution Approach 2:
The chambers are filled with liquid crystal material that serves as a working fluid for heat dissipation. The liquid crystal provides superior thermal conductivity compared to air or vacuum, enabling efficient heat transfer within the confined thin-space environment without requiring complex mechanical cooling systems
3Reliability
If the heat transfer area is increased, then the heat dissipation efficiency improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation structure is integrated directly into the substrate, merging the heat dissipation function with the structural substrate. The first and second heat dissipation regions are combined in a single substrate layer, eliminating the need for separate heat dissipation components and reducing manufacturing complexity while maximizing heat transfer area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves heat dissipation efficiency and aligns with the trend of developing thinner electronic devices by effectively utilizing internal space and increasing the heat transfer area through the use of chambers and a working fluid.
Implementation Method 1
The working fluid is filled into the chambers... the heat transfer area and efficiency while accommodating electronic modules
Data Source
AI summary
A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.