Flow Enhancement Structure for Immersion Cooling Heat Sink Fins
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Solution Overview
Problem
High-performance computing environments, such as data centers, face challenges in efficiently transferring heat from electronic components to immersion bath liquids due to impediments in fluid flow caused by circuit board arrangements, leading to insufficient heat transfer and flow stagnation.
Innovation Solution
The implementation of a flow enhancement structure positioned near heat sinks to direct and increase fluid flow through the fins, combined with design improvements like pressurized fluid flow heads and transfer plates to optimize fluid flow and heat removal, and the use of overflow chambers to manage fluid levels and flow rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If circuit boards are arranged in immersion bath to cool electronic components, then heat transfer from components to liquid is achieved, but fluid flow is impeded causing flow stagnation and insufficient heat transfer
Solution Approach 1:
A flow enhancement structure is introduced as an intermediary element between the circuit board and the immersion liquid. This structure actively directs and channels the liquid flow toward the heat sink fins, overcoming the flow stagnation caused by the circuit board arrangement and enhancing heat transfer without requiring changes to the fundamental immersion cooling configuration.
2Temperature
If flow enhancement structure is added to increase fluid flow through heat sink fins, then thermal transfer efficiency is enhanced, but device complexity increases
Solution Approach 1:
The flow enhancement structure is positioned locally at specific regions where fluid flow impingement is most beneficial, rather than implementing a complex system-wide solution. The structure focuses its flow-directing function on the heat sink fins area, providing localized enhancement of thermal transfer while maintaining simplicity elsewhere in the system.
3Temperature
If multiple flow enhancement structures are implemented on circuit boards, then heat removal capacity is improved, but manufacturing complexity increases
Solution Approach 1:
The flow enhancement capability is divided into multiple discrete structures that can be independently manufactured and then assembled onto the circuit board. This segmentation allows for standardized production of individual flow enhancement elements, simplifying the overall manufacturing process while still achieving enhanced heat removal capacity through the combined effect of multiple structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal transfer efficiency by increasing fluid velocity through heat sink fins, improving heat removal capacity, and allowing for flexible configuration and energy-efficient operation of immersion cooling systems.
Implementation Method 1
enhances thermal transfer efficiency by increasing fluid velocity through heat sink fins
Implementation Method 2
flow enhancement structure positioned near heat sinks to direct and increase fluid flow through the fins
Implementation Method 3
heat transfer from electronic components to immersion bath liquids
Data Source
AI summary
An apparatus is described that includes an immersion bath chamber and a cover that is to seal the immersion bath chamber. An apparatus is described that includes an immersion bath chamber and an installable/removable transfer member. The installable/removable transfer member has fluidic connectors designed to couple to respective warmed fluid flow output ports of pluggable units to be cooled in the immersion bath chamber and having respective backplane interface designs. An apparatus is described that includes an immersion bath chamber and an overflow chamber. The overflow chamber is to receive an overflow of liquid coolant from the immersion bath chamber, wherein a first exit flow channel from the overflow chamber is coupled to a second exit fluid flow channel from the immersion bath chamber through a valve, wherein, an opening of the valve is controllable to vary a gravitational fluid flow within the immersion bath chamber.