Silicon Carbide Heat Dissipation Layer for Electronic Device Thermal Management
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Solution Overview
Problem
Current epoxy molding compounds used in electronic device packaging suffer from poor heat dissipation due to low thermal conductivity, which can reduce the performance and reliability of electronic elements.
Innovation Solution
Incorporating a heat dissipation layer with an insulating material layer and silicon carbide particles, where the silicon carbide particles have a rounded-corner structure, to enhance thermal conductivity and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional epoxy molding compound is used, then the package structure is easy to manufacture, but the heat dissipation performance is poor
Solution Approach 1:
The patent uses a composite material consisting of insulating material layer and silicon carbide particles to create the heat dissipation layer. This composite structure combines the electrical insulation properties of the insulating material with the high thermal conductivity of silicon carbide particles, achieving both good heat dissipation performance and electrical insulation while maintaining manufacturing feasibility
Solution Approach 2:
The patent changes the thermal conductivity parameter by introducing silicon carbide particles with specific physical and chemical properties into the heat dissipation layer. The silicon carbide particles have high thermal conductivity, which fundamentally changes the thermal transfer capability of the package structure, enabling effective heat dissipation while maintaining manufacturing processes
2Temperature
If silicon carbide particles are added to improve thermal conductivity, then heat dissipation improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by concentrating silicon carbide particles specifically in the heat dissipation layer adjacent to the chip unit, rather than distributing them throughout the entire package structure. This localized approach improves thermal conductivity where most needed while minimizing manufacturing complexity and material costs in other areas
Solution Approach 2:
The insulating material layer serves as an intermediary between the silicon carbide particles and the surrounding environment. It provides electrical insulation while allowing thermal transfer, and simplifies the manufacturing process by containing the silicon carbide particles in a defined layer, reducing the overall structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation layer effectively conducts heat away from the chip, improving the thermal management of electronic devices and enhancing their reliability and performance compared to traditional epoxy molding compounds.
Implementation Method 1
the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles... effectively conducts heat away from the chip
Data Source
AI summary
An electronic device is provided by the present disclosure, wherein the electronic device includes at least one chip unit, a circuit structure electrically connected to the at least one chip unit, and a heat dissipation layer disposed at a side of the at least one chip unit opposite to the circuit structure, wherein the heat dissipation layer includes an insulating material layer and a plurality of silicon carbide particles, the insulating material layer clads the silicon carbide particles, and the silicon carbide particles have rounded-corner structures.