Semiconductor Cooling Flow Structure for Uniform Refrigerant Distribution
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Solution Overview
Problem
Existing cooling apparatuses for semiconductor modules suffer from non-uniform refrigerant flow speed distribution, leading to inefficiencies and potential energy loss.
Innovation Solution
Incorporation of loss adding portions in the refrigerant delivery portion of the cooling apparatus, which generate pressure loss to equalize refrigerant flow speed, combined with cooling fins to manage heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fins are added to increase heat transfer area, then heat transfer efficiency is improved, but pressure loss increases and flow distribution becomes non-uniform
Solution Approach 1:
The patent applies local quality by creating different flow resistance characteristics in different regions of the refrigerant delivery portion. Loss adding portions are strategically positioned to create localized pressure drops that compensate for the non-uniform flow distribution caused by cooling fins, ensuring each region receives appropriate refrigerant flow for optimal heat transfer.
Solution Approach 2:
The loss adding portions are designed to preemptively counteract the non-uniform flow distribution that would otherwise occur naturally in the refrigerant delivery system. By introducing controlled resistance before the refrigerant reaches certain areas, the system pre-balances the flow distribution to achieve uniform cooling across all regions.
2Stability of the object's composition
If loss adding portions are added to equalize flow distribution, then flow uniformity is improved, but device complexity increases
Solution Approach 1:
The loss adding portions are merged with the cooling fin structure and the refrigerant delivery portion housing. Rather than being separate components, they are integrated into the existing thermal management architecture, thereby achieving flow equalization without proportionally increasing device complexity.
Solution Approach 2:
The loss adding portions serve multiple functions: they create pressure drop to equalize flow distribution, they can be integrated with structural components of the refrigerant delivery portion, and they work in conjunction with cooling fins to achieve both flow control and thermal management in a single integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Uniform refrigerant flow distribution enhances cooling efficiency and reduces energy loss, maintaining effective heat transfer while minimizing apparatus size increase.
Implementation Method 1
the loss adding portion generating pressure loss in the refrigerant passing therethrough
Implementation Method 2
cooling fin portion that is arranged in the refrigerant delivery portion
Implementation Method 3
refrigerant delivery portion through which a refrigerant flows
Data Source
AI summary
The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is let into the refrigerant delivery portion and an outlet port through which the refrigerant is let out; a cooling fin portion arranged in the refrigerant delivery portion of the casing portion and between the two opening portions; and a loss adding portion arranged in the refrigerant delivery portion of the casing portion and between the cooling fin portion and at least one of the two opening portions, the loss adding portion generating pressure loss in the refrigerant passing therethrough.