Phase-Change Cooling Panel With Gravity-Resistant Refrigerant Distribution

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Solution Overview

Problem

Conventional heat dissipation apparatuses face limitations in distributing liquefied refrigerant against gravity, leading to reduced heat dissipation performance and complex manufacturing processes due to reliance on surface tension and wick members.

Innovation Solution

A heat dissipation apparatus with an absorber that distributes liquefied refrigerant in a direction opposite to gravity using the material's absorption rate, combined with a frame retention part to maintain shape and prevent deformation, utilizing non-woven fabric, cotton, or sponge for the absorption body and a metal frame retention part.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a wick member with multiple pores is integrated with the refrigerant flow space using a sintering method to distribute liquefied refrigerant, then the refrigerant distribution capability is improved, but the manufacturing complexity and installation complexity increase significantly

Engineering Contradiction:
Improverefrigerant distribution capabilityVSAvoidmanufacturing and installation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts the wick member from the integrated sintered structure and makes it a separate, removable component. This allows the wick member to be independently manufactured and then installed into the refrigerant flow space, significantly simplifying the manufacturing process and installation while maintaining the refrigerant distribution capability through the porous structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention divides the heat dissipation apparatus into separate functional components: the heat dissipation plate, the wick member, and the refrigerant flow space. This segmentation allows each component to be optimized and manufactured independently, reducing overall manufacturing complexity while maintaining system performance.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If the heat dissipation apparatus is horizontally disposed at the top of flat heating elements to transfer heat, then the manufacturing is simplified, but the usage flexibility and adaptability are very limited

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidusage flexibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The invention enables the heat dissipation apparatus to adapt to different orientations and configurations. The separated wick member design and the gravitational independence achieved through capillary action allow the apparatus to function effectively in vertical, horizontal, or inclined arrangements, providing dynamic adaptability to various installation scenarios and heating element configurations.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation performance by uniformly distributing liquefied refrigerant, allowing for varied heating element arrangements and reducing manufacturing complexity.

Implementation Method 1

an absorber disposed in the refrigerant flow space of the heat conduction panel body and configured to distribute a liquefied refrigerant included in the refrigerant in a direction of gravity or at least in a direction opposite to the direction of gravity while absorbing and retaining the liquefied refrigerant

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Implementation Method 2

the absorber maintains an absorption rate for the liquefied refrigerant by a material itself, and a shape of the absorber is prevented from being deformed in the direction of gravity

Methodology Applied
Scientific EffectShape retention:

Implementation Method 3

a heat conduction panel body in which a refrigerant flow space where a liquefied refrigerant and a gaseous refrigerant are circulated while a state of a refrigerant filled therein is changed has been formed

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 4

a refrigerant flow space where a liquefied refrigerant and a gaseous refrigerant are circulated while a state of a refrigerant filled therein is changed

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentEP4586752A1Heat dissipation apparatus for electronic device
Publication Date: 2025.07.16 KMW INC
  • EP4586752A1 patent drawingFigure 1
  • EP4586752A1 patent drawingFigure 2
  • EP4586752A1 patent drawingFigure 3

AI summary

The present invention relates to a heat dissipation apparatus for an electronic device. In particular, the heat dissipation apparatus comprises: a heat conduction panel body having formed therein a refrigerant flow space in which, while charged refrigerant changes in phase, gas-liquid circulation takes place; and an absorber which is disposed in the refrigerant flow space of the heat conduction panel body, and which distributes, while absorbing and holding the liquefied refrigerant of the refrigerant, the liquefied refrigerant in the direction of gravity or at least in a direction opposite to the direction of gravity, wherein, due to the material itself, the absorber prevents shape deformation in the direction of gravity even while maintaining the absorption rate for the liquefied refrigerant, and thus, provided is the advantage of greatly improving overall heat dissipation performance.