Semiconductor Cooling Plate Interlocking Recesses
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Solution Overview
Problem
The adhesion between the sealing member and the cooling plate in semiconductor devices decreases over time, leading to potential moisture ingress and separation, which compromises the insulation and reliability of the semiconductor chips and circuit substrates.
Innovation Solution
Incorporating interlocking portions on the cooling plate with a U-shaped recess and inclined engagement surfaces, which provide an anchoring effect to prevent the separation of the sealing member, ensuring consistent adhesion and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing member and cooling plate are adhered using adhesion alone, then the device structure is simple, but the adhesion strength reduces with aging leading to separation and moisture ingress
Solution Approach 1:
The cooling plate surface is segmented into multiple recesses, each containing a projection that forms an interlocking interface with the sealing member. This segmentation creates multiple localized adhesion points distributed across the bonding surface, preventing catastrophic failure and maintaining seal integrity over extended service life.
Solution Approach 2:
The recesses are strategically positioned at locations where adhesion is most critical, creating localized interlocking features rather than uniform adhesion across the entire surface. This local quality enhancement focuses the bonding strength where it is most needed to prevent separation and moisture ingress.
2Reliability
If the cooling plate surface is made flat for simple manufacturing, then manufacturing is easier, but adhesion deteriorates over time leading to sealing failure
Solution Approach 1:
The recesses and projections are pre-formed into the cooling plate during manufacturing, creating the interlocking structure before the sealing member is applied. This preliminary action ensures that the adhesion-enhancing features are already in place, eliminating the need for complex post-assembly operations while guaranteeing reliable sealing performance.
Solution Approach 2:
The recesses feature curved engagement surfaces that provide mechanical interlocking with the sealing member projections. These curved geometries create favorable stress distribution and enhanced bonding contact areas, improving sealing reliability while remaining compatible with conventional manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interlocking portions enhance the adhesion between the sealing member and the cooling plate, preventing separation and maintaining the insulation and reliability of the semiconductor device.
Implementation Method 1
an engagement surface disposed inside the recess and being inclined at an acute angle with respect to the cooling front surface... the engagement surface inclined at an acute angle provides friction resistance, thereby preventing peeling of the sealing member
Data Source
AI summary
A semiconductor device includes a semiconductor unit including a semiconductor chip, a cooling plate having a cooling front surface on which the semiconductor unit is disposed, a case disposed along an outer edge of the cooling front surface at the outer edge via an adhesive so as to surround the semiconductor unit, and a sealing member sealing the semiconductor unit disposed on the cooling plate inside the case. The cooling plate has an interlocking portion, the interlocking portion including a recess in the cooling front surface, and an engagement surface disposed inside the recess and being inclined at an acute angle with respect to the cooling front surface.