Interference-Fit Cooling Plate for Leak-Proof PCB Heat Dissipation
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Solution Overview
Problem
There is a need for improved systems and methods to effectively cool electronic components and devices, particularly in systems with heat-generating components, to manage heat dissipation efficiently.
Innovation Solution
The implementation of a cooling system involving a core with surface channels and a cover that creates a leak-proof seal through an interference fit, utilizing thermal expansion or shrinking to couple components, and incorporating a fluid transport system to manage heat transfer and fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling systems are used with multiple separate components, then heat dissipation can be achieved, but the system complexity and potential leakage points increase
Solution Approach 1:
The patent combines the core and cover into an integrated cooling system where the cover acts as both a structural component and a sealing element. The interference fit between the core peripheral edge and cover internal peripheral wall creates a unified structure that eliminates separate sealing components, thereby improving reliability while maintaining manageable complexity.
Solution Approach 2:
The cooling channels are nested within the core structure, with the cover enclosing these channels. The fluid passage system is nested within the core, and the entire cooling assembly is designed to fit within the electronic device housing, creating a compact nested arrangement that reduces overall system complexity.
2Reliability
If interference fit is used to couple core and cover, then leak-proof sealing is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes thermal expansion parameter changes to facilitate the interference fit assembly process. By heating the cover or cooling the core during assembly, the tolerance requirements are temporarily relaxed, allowing for easier assembly while still achieving the required seal integrity when the components return to operating temperature.
3Temperature
If thermal communication is established between core and PCB, then heat transfer efficiency improves, but thermal management complexity increases
Solution Approach 1:
The core is designed with thermal communication capability directly integrated with the PCB mounting surface. The core structure itself serves as the thermal interface between the electronic components on the PCB and the fluid channels, eliminating the need for separate thermal interface materials or components and simplifying the overall thermal management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides effective heat dissipation and leak-proof sealing, enhancing the cooling efficiency and reliability of electronic devices by managing heat transfer and fluid flow effectively.
Implementation Method 1
coupling the core and the cover with an interference fit includes shrinking the core by cooling it, then placing the core inside the cover
Implementation Method 2
coupling the core and the cover with an interference fit includes expanding the cover by heating it, then placing the core inside the cover
Implementation Method 3
The channels are configured to transport a fluid
Implementation Method 4
the first core side is configured to be in thermal communication with a printed circuit board
Data Source
AI summary
Methods of manufacturing a cooling system include providing a core or plate having first and second sides, forming surface channels on the second side, and providing a fluid inlet and a fluid outlet on the first side coupled to the channels. A cover is configured to enclose the channels, and the cover and the core or plate are joined by interference or thermal fitting to form a sealed structure. In certain embodiments, the cover includes a peripheral raised wall that receives a peripheral edge of the plate to facilitate coupling. The methods provide compact cooling systems that enable efficient circulation of fluid through surface channels while maintaining reliable thermal transfer.