Circuit Fluid Transport TRIZ Cases
- Dual-Flow Liquid Connectors for Compact Module Cooling
Nested chassis and module dual-flow connectors simplify liquid-cooled module assembly while freeing backplane I/O space and improving thermal control.
- Programmable PCB With Electrowetting Traces for Rapid Prototyping
Electrowetting moves working-metal droplets across unit cells to reconfigure PCB traces quickly, cutting prototype time, cost, and waste.
- Flow-Through PCB Cooling Structure for High-Current Heat Dissipation
A flow-through PCB structure cuts current impedance and removes heat through vertical conduction paths and heat dissipation channels.
- Interference-Fit Cooling Plate for Leak-Proof PCB Heat Dissipation
Surface channels in a cooling plate are sealed by thermal-fit cover assembly, improving PCB heat dissipation while reducing leak paths.
- 3D Stretchable Microelectrode Arrays With Pockets for Organoid Recording
A 3D pocketed stretchable microelectrode array records organoid signals while microfluidic diffusion and mechanical stimulation improve in vitro relevance.
- Parallel PCB Interposer Structure for Compact Board Connections
Interposers with via holes and through holes connect parallel circuit boards, improving mounting space while supporting structural stability.
- PCB Cooling Core With Thermal-Fit Leak-Proof Sealing
Integrated channels move working fluid through a PCB cooling core, while a heated cover contracts into a leak-proof interference fit.
- Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same
This case examines a bonded PCB-cold plate assembly that combines electrical isolation, heat conduction, and reduced interface stresses.
- Integrated Circuit Package Heatsink Assembly for Off-Axis Hotspot Cooling
This case uses a spaced heatsink assembly and thermally conductive material to cool IC package hotspots without direct alignment.
- Autonomous Vehicle Sensor Heat Dissipation via Coldplate and Vapor Chambers
Pyrolytic graphite spreaders and phase change materials reduce thermal resistance, preventing performance degradation in constrained environments.
- Induced Air Convection Cooling for Computing Devices
A heatsink with channels induces air convection to dissipate heat from printed circuit boards without mechanical fans.
- Microfluidic Die on Rigid Substrate for Vertical Ejection
A thermal microfluidic die couples to a rigid planar support board with an inert liner, enabling vertical fluid ejection.