PCB Cooling Core With Thermal-Fit Leak-Proof Sealing
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Solution Overview
Problem
There is a need for improved systems and methods to effectively cool electronic components and devices, particularly in the context of increasing heat generation within electronic devices.
Innovation Solution
A printed circuit board (PCB) cooling system is designed with a core and cover that form a leak-proof seal via a thermal interference fit, incorporating channels for fluid transport to manage heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling systems are used, then heat dissipation is provided, but leak proof sealing is difficult to achieve
Solution Approach 1:
The patent applies thermal expansion by heating the cover to expand its dimensions, allowing it to be fitted over the core. When cooled, the cover contracts to form an interference fit that creates a leak-proof seal without requiring additional sealing components.
Solution Approach 2:
The patent changes the thermal parameter (temperature) of the cover during assembly. By heating the cover to expand it and then allowing it to cool and contract, the physical dimensions and fit characteristics are dynamically adjusted to achieve a leak-proof seal.
2Reliability
If thermal interference fit is used to create leak proof seal, then sealing reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process utilizes thermal expansion by heating the cover in an oven or other heating device before assembly. This temporary expansion allows for easier fitting over the core, and the subsequent cooling creates the interference fit seal automatically.
Solution Approach 2:
The cover is pre-heated before assembly to expand it, making the assembly process easier. This preliminary thermal treatment prepares the cover in advance to accommodate the interference fit requirement without requiring complex assembly tools or procedures.
3Temperature
If channels are added for fluid transport, then heat transfer efficiency is improved, but structural complexity increases
Solution Approach 1:
The patent merges the cooling channels directly into the core structure itself, rather than using separate channel components. The channels are formed as integral features of the core, eliminating the need for additional channel parts while maintaining effective fluid transport for heat dissipation.
Solution Approach 2:
The core serves multiple functions: it provides structural support for the electronic components and simultaneously acts as the fluid transport channel through its internal geometry. This multi-functionality reduces the number of separate components needed in the cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides efficient heat transfer and fluid flow to effectively cool electronic components, ensuring a leak-proof seal and optimized thermal communication.
Implementation Method 1
The thermal interference fit results from cooling the core and fitting the core inside the cover
Implementation Method 2
The thermal interference fit results from expanding the cover by heating the cover, and then fitting the core inside the cover while the cover is expanded
Implementation Method 3
The cooling module is thermally connected to a heat-generating electronic component on a circuit board of the electronic system and cools the electronic component by a coolant flowing in the cooling module
Implementation Method 4
the core configured to be thermally coupled to at least one heat producing electronic component
Data Source
AI summary
Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a core having a plurality of surface channels configured to facilitate the transport of a working fluid. The cooling system can include a cover configured to cover the surface channels, and further configured to couple to the core to form a leak proof seal with an interference fit. In some embodiments, the interference fit can be the result of a thermal fitting. The core can be a metal core printed circuit board. The core can be configured to be in thermal communication with a printed circuit board. In certain embodiments, the surface channels are in communication with a fluid inlet and a fluid outlet; the fluid inlet and the fluid outlet can be placed on a side of the core opposite a side of the core having the surface channels.