Parallel PCB Interposer Structure for Compact Board Connections
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Solution Overview
Problem
Existing technologies face challenges in efficiently arranging and connecting multiple circuit boards in electronic devices to optimize mounting and wiring space while maintaining electrical connectivity and structural integrity.
Innovation Solution
The use of interposers with via holes and through holes, along with non-conductive fillers, to connect and separate circuit boards, allowing for efficient spacing and electrical connection while providing structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple circuit boards are arranged closely to optimize mounting space, then the area efficiency is improved, but the complexity of electrical connection and structural assembly increases
Solution Approach 1:
An interposer is introduced as an intermediary component between two circuit boards. The interposer includes a first surface facing the first circuit board, a second surface facing the second circuit board, and a side surface connecting them. Through holes are formed through the interposer to electrically connect electrical elements on both circuit boards. This intermediary structure simplifies the overall assembly by providing a dedicated connection interface, reducing the complexity of direct board-to-board connections while enabling compact mounting space utilization.
2Ease of manufacture
If circuit boards are separated by gaps to facilitate wiring and mounting, then the ease of manufacture is improved, but the volume of the assembly increases
Solution Approach 1:
The interposer utilizes the vertical dimension (height direction) to bridge the gap between two circuit boards. Instead of increasing horizontal spacing, the connection is achieved through the thickness of the interposer component. Through holes are formed vertically through the interposer to establish electrical connections, allowing compact horizontal arrangement while maintaining manufacturing accessibility. This dimensional approach enables gap accommodation without proportionally increasing overall assembly volume.
3Reliability
If through holes are formed through circuit boards for electrical connection, then the electrical connectivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The interposer serves as a mediator that absorbs and manages the alignment tolerances between two circuit boards. Through holes are formed through the interposer at positions corresponding to electrical elements on both circuit boards. The interposer's side surface provides a reference plane that facilitates precise hole formation and assembly alignment, reducing the cumulative precision requirements compared to direct board-to-board through-hole alignment. This intermediary structure isolates the precision requirements to the interposer-circuit board interfaces rather than requiring precise alignment between distant circuit board surfaces.
Data Source
AI summary
An electronic device includes a housing including a front surface, a rear surface that is opposite to the front surface, and a side surface enclosing an inner space between the front surface and the rear surface, a display that is visually exposed to the outside of the electronic device, and a printed circuit board that is in the inner space. The printed circuit board includes a plurality of circuit boards that are parallel to one another and include electrical elements and one or more interposers that are between the plurality of circuit boards and connecting a pair of circuit boards adjacent to each other in a height direction. The one or more interposers include one or more via holes, a via and one or more interposer through holes.