Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same
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Solution Overview
Problem
The manufacture of multi-layer printed circuit boards (PCBs) is challenging due to design and manufacturing complexities, particularly in integrating power devices and ensuring reduced thermal and mechanical stresses.
Innovation Solution
A highly integrated power electronics embedded PCB-cold plate assembly is formed by sandwiching a low thermal resistance (LTR) dielectric layer between a cold plate and a power electronics embedded PCB, bonded via high temperature and pressure, with the LTR dielectric layer providing electrical isolation and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multi-layer PCBs are used to increase component density, then the capacity and density of electronic components improve, but the design and manufacturing complexity increases
Solution Approach 1:
The patent merges the PCB substrate with the cold plate into a single integrated assembly, eliminating the need for separate multi-layer PCB construction and reducing manufacturing steps. Power devices are embedded directly into the integrated structure during fabrication, combining multiple components and functions into one unified device that achieves high component density without proportional increases in manufacturing complexity
Solution Approach 2:
The integrated PCB-cold plate assembly serves multiple functions simultaneously: it provides mechanical support for power devices, electrical connections through conductive pathways, thermal management through the cold plate, and structural integration. This multi-functionality reduces the number of separate components needed, thereby increasing effective component density while simplifying the overall system
2Temperature
If power devices are bonded directly to the cold plate, then heat transfer efficiency improves, but thermal and mechanical stresses at the interface increase
Solution Approach 1:
The patent introduces an LTR dielectric layer as an intermediary between the power devices and the cold plate. This intermediate layer serves dual purposes: it provides electrical insulation to prevent short circuits while maintaining low thermal resistance to allow efficient heat conduction from the power devices to the cold plate, thereby reducing thermal stresses without compromising heat transfer efficiency
Solution Approach 2:
The patent changes the thermal parameter of the dielectric layer by selecting materials and designing the layer with low thermal resistance characteristics. This parameter change allows the dielectric layer to conduct heat effectively while still providing electrical isolation, thus improving heat transfer efficiency and reducing thermal stresses at the interface between power devices and the cold plate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This assembly achieves reduced thermal resistance and mechanical stresses, maintaining power device-substrate assemblies below predefined temperatures with effective heat transfer and electrical insulation.
Implementation Method 1
a low thermal resistance (LTR) dielectric layer sandwiched between the cold plate and the power electronics embedded PCB such that the power electronics embedded PCB is bonded to the cold plate via the LTR dielectric layer
Implementation Method 2
bonding a power electronics embedded PCB fabrication panel to the LTR dielectric layer using high temperature and high pressure
Data Source
AI summary
A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.