Flow-Through PCB Cooling Structure for High-Current Heat Dissipation
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Solution Overview
Problem
Existing PCBs face challenges with high current loss and poor heat dissipation due to impedance issues in the surface layer, leading to overheating and potential burnout.
Innovation Solution
A flow-through heat dissipation apparatus comprising a flow-through component and a heat dissipation component, with a heat dissipation channel, connected to the circuit board to facilitate current flow and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional PCB surface layer is used for power transmission, then current flow is achieved, but high current loss and heat generation occur due to impedance control difficulties
Solution Approach 1:
The invention divides the power transmission path into two segments: the lower surface layer for current input and the upper surface layer for current output, with the flow-through component bridging them vertically. This segmentation allows each layer to have optimized impedance characteristics while reducing overall current loss and heat generation in the power transmission network.
Solution Approach 2:
The invention transitions from traditional two-dimensional planar power transmission to three-dimensional transmission by adding vertical through-holes that penetrate the PCB thickness direction. This dimensional change creates additional current pathways and reduces reliance on single-layer impedance control, thereby reducing current loss and heat accumulation.
2Reliability
If heat dissipation is not addressed, then PCB operation continues, but overheating and burnout occur due to accumulated heat
Solution Approach 1:
The invention extracts heat from the PCB interior by introducing flow-through components with through-holes that create direct thermal conduction pathways from the heat-generating lower layer to the cooler upper layer. This extraction mechanism removes accumulated heat efficiently, preventing overheating and burnout while maintaining reliable PCB operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces current impedance and enhances heat dissipation, preventing overheating and extending the lifespan of the circuit board.
Implementation Method 1
the flow-through component comprises a flow-through plate having a plurality of through-holes formed therein, the plurality of through-holes extending in a thickness direction of the flow-through plate
Implementation Method 2
the heat dissipation component is arranged on a first surface of the flow-through component
Implementation Method 3
at least part of the region of the flow-through heat dissipation apparatus is provided with a heat dissipation channel
Data Source
Figure 1
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AI summary
Disclosed in the present application is a flow-through heat dissipation apparatus which is applied to a circuit board. The flow-through heat dissipation apparatus comprises a flow-through component and a heat dissipation component; the heat dissipation component is arranged on the first surface of the flow-through component, the second surface of the flow-through component is used for being connected to a circuit layer of the circuit board, and the second surface and the first surface are arranged opposite to each other in the first direction; at least part of the area of the flow-through heat dissipation apparatus is provided with a heat dissipation channel.